Abstract: A method of predicting pressure ulcers is provided. The method includes predicting, by a first pressure ulcer predictor, occurrence of pressure ulcers of a patient to output first prediction result data, based on body data of the patient, predicting, by a second pressure ulcer predictor, occurrence of pressure ulcers of the patient to output second prediction result data, based on whole body pressure data of the patient, predicting, by a third pressure ulcer predictor, occurrence of pressure ulcers of the patient to output third prediction result data, based on skin image data of the patient, and concatenating the first to third prediction result data to output final prediction result data.

Abstract: Provided is an optical system which may acquire a hyperspectral image by acquiring a spectral image of an object to be measured, which includes, to collect spectral data and train the neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, a slit moving to scan the incident image and passing and outputting a part of the formed image, and a first optical part obtaining spectral data by splitting light of the image received through the slit by wavelength. Also, the system includes, to decompose overlapped spectral data and to infer hyperspectral image data through the trained neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, and a first optical part obtaining spectral data by splitting light of the received image by wavelength.

Abstract: This invention relates to a positive photosensitive resin composition that includes a siloxane copolymer of two kinds of reactive silane compounds with specific structures wherein residual impurities such as unreacted monomers and catalysts are minimized, and a UV absorber including one or more kinds of phenol hydroxyl groups capable of crosslinking and an alkoxy group. Accordingly, the resin composition exhibits excellent performances such as sensitivity, resolution, and degree of planarization, and also has excellent weatherability and UV absorbance, thereby providing excellent panel reliability.

Abstract: Provided is a chemical test apparatus for testing a chemical used to process a substrate, the chemical test apparatus including a first line providing an inlet through which the chemical is introduced, and a passage through which the chemical moves, a second line having an end and another end connected to two separate points of the first line, and providing a passage in which the chemical introduced into the first line is filled, a discharge line connected to a lower end of the first line, and a valve disposed between the first line and the discharge line at least below portions of the first line connected to the second line, to open or close a passage through which the chemical moves from the first line to the discharge line.

Abstract: The present invention relates to a method for fabricating a semiconductor device; and, more particularly, to a photoresist pattern to form a fine line width of about 0.1 &mgr;m or less. A method for forming fine photoresist patterns according to the present invention comprises the step of: forming photoresist patterns over a semiconductor substrate using a stepper; and ashing the photoresist patterns using oxygen radicals in order to decrease line width of the photoresist patterns. The oxygen radicals are formed by a thermal decomposition of an ozone gas in an ozone asher. Accordingly, the present invention overcomes the resolution of the stepper by controlling the ashing rate at a low temperature using the oxygen radicals in the ozone asher.

Abstract: The present invention relates to a method for fabricating a semiconductor device; and, more particularly, to a photoresist pattern to form a fine line width of about 0.1 &mgr;m or less. A method for forming fine photoresist patterns according to the present invention comprises the step of: forming photoresist patterns over a semiconductor substrate using a stepper; and ashing the photoresist patterns using oxygen radicals in order to decrease line width of the photoresist patterns. The oxygen radicals are formed by a thermal decomposition of an ozone gas in an ozone asher. Accordingly, the present invention overcomes the resolution of the stepper by controlling the ashing rate at a low temperature using the oxygen radicals in the ozone asher.