Abstract: A diode device and a semiconductor device including the diode device, the diode device including an active layer including a 5d transition mixed-metal oxide including a first element and a second element different from the first element. The composition ratios of the first element relative to the second element incrementally varies along a thickness direction of the active layer.

Abstract: There is provided a method performed by a system for obtaining a relative location of an anchor-free UWB-based node. The method includes obtaining relative distances between a plurality of nodes based on UWB sensor values between the nodes, constructing a relative coordinate system having a center node of the plurality of nodes as a base, and calculating coordinate values of other nodes in the relative coordinate system. The constructing of the relative coordinate system having the center node of the plurality of nodes as a base includes constructing the relative coordinate system based on a relative distance between the center node and another node and absolute values of y axis values.

Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.

Abstract: A secondary battery includes an electrode assembly including an electrode tab, a current collector plate including at least one opening and contacting one surface of the electrode tab, and a welding portion formed along at least a portion of a boundary between the electrode tab and the current collector plate in contact with each other in the opening to bond a portion of the one surface of the electrode tab exposed through the opening to the current collector plate.

Abstract: An electrode assembly support device includes a base portion including a mounting portion on which an electrode assembly including an electrode tab protruding from at least on one side is mounted in a first direction, a thickness direction of the electrode assembly, a body portion coupled to one side of the base portion, and a step portion coupled to the body portion and disposed to be perpendicular to the mounting portion to support the electrode tab, wherein at least a portion of the step portion is configured to protrude in the first direction compared to the mounting portion to form a first step.

Abstract: A positive electrode active material includes a lithium composite transition metal oxide in the form of a single particle. The lithium composite transition metal oxide includes Al, Y, and Zr. The method for preparing the positive electrode active material is also provided. Additionally, a positive electrode and a lithium secondary battery including the same are also provided.

Abstract: In one example, an electronic device includes a substrate, an electronic component disposed over the substrate, and an encapsulant disposed over the substrate and the electronic component. A molded heat spreader can be disposed over the encapsulant and can comprise a heat spreader and a mold compound disposed around a lateral side of the heat spreader. A lateral side of the mold compound is coplanar with a lateral side of the encapsulant. Other examples and related methods are also disclosed herein.

Abstract: A battery cell includes an electrode assembly in which a plurality of electrode plates are stacked; a protective assembly disposed on at least one side of the electrode assembly and including an insulating material; and a case having an internal space in which the electrode assembly is accommodated, wherein the protective assembly includes a through-hole configured to allow electrolyte to pass therethrough.

Abstract: A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

Abstract: A battery cell includes an electrode assembly in which a plurality of electrode plates are stacked; a protective assembly disposed on at least one side of the electrode assembly and including an insulating material; and a case having an internal space in which the electrode assembly is accommodated, wherein the protective assembly includes a through-hole configured to allow electrolyte to pass therethrough.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: A packaged electronic device includes a molded substrate with a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side; an inner lead having an inner lead outward side and an inner lead inward side; and a substrate encapsulant. An electronic component is connected to the edge lead and the inner lead. A body encapsulant covers the electronic component and portions of the conductive structure. An upper portion of the edge lead outward side is exposed from one side of the body encapsulant. A conductive cover is over a top side and sides of the body encapsulant and outer sides of the substrate encapsulant. The conductive cover contacts the upper portion of the edge lead outward side.

Abstract: A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

Abstract: A battery cell is provided. The battery cell comprising a housing having an internal space in which an electrode assembly is accommodated; a cap assembly coupled to the housing and closing the internal space; and a vent member coupled to the housing and configured to open when internal pressure of the housing is equal to or higher than a reference value, wherein the vent member is coupled to an inner side of the housing.

Abstract: Provided is a method of operating an unmanned mobile vehicle for detecting an indoor environment. The method according to an embodiment of the present disclosure includes obtaining first motion information using a LiDAR sensor provided on the unmanned mobile vehicle, obtaining second motion information using an inertial sensor provided on the unmanned mobile vehicle, performing correction on the first motion information and the second motion information on the basis of error models corresponding to the LiDAR sensor and the inertial sensor, and determining final position information of the unmanned mobile vehicle on the basis of the correction.

Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: In one example, a packaged electronic device includes a molded substrate. The molded substrate includes a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side opposite to the edge lead outward side, and an inner lead having an inner lead outward side and an inner lead inward side opposite to the inner lead outward side. The molded substrate includes a substrate encapsulant covering a lower portion of the edge lead inward side, a lower portion of the inner lead inward side, and a lower portion of the inner lead outward side. An upper portion of the edge lead outward side and an upper portion of the inner lead outward side are exposed from the substrate encapsulant. An electronic component is connected to the edge lead and the inner lead. A body encapsulant covers the electronic component and portions of the conductive structure.

Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.

Abstract: In one example, an electronic device comprises a substrate comprising a first side and a second side opposite the first side, wherein the substrate comprises a first groove at the second side of the substrate, a first electronic component over the first side of the substrate, and a resin in the first groove. The substrate comprises a floating pad at the first side of the substrate, a second groove at the first side of the substrate, and a third groove at the first side of the substrate, wherein the floating pad is between the second groove and the third groove. Other examples and related methods are also disclosed herein.