Patents by Inventor Gi-Jin Kim

Gi-Jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990284
    Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: May 21, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Seon Jae Mun, Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha
  • Patent number: 11976975
    Abstract: Provided is an optical system which may acquire a hyperspectral image by acquiring a spectral image of an object to be measured, which includes, to collect spectral data and train the neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, a slit moving to scan the incident image and passing and outputting a part of the formed image, and a first optical part obtaining spectral data by splitting light of the image received through the slit by wavelength. Also, the system includes, to decompose overlapped spectral data and to infer hyperspectral image data through the trained neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, and a first optical part obtaining spectral data by splitting light of the received image by wavelength.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: May 7, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Keo Sik Kim, Kye Eun Kim, Jeong Eun Kim, Hyun Seo Kang, Hyun Jin Kim, Gi Hyeon Min, Si Woong Park, Hyoung Jun Park, Chan Il Yeo, Young Soon Heo
  • Publication number: 20240130227
    Abstract: The present invention provides a heterocyclic compound represented by Formula 1 and an organic light-emitting device comprising the same.
    Type: Application
    Filed: November 16, 2021
    Publication date: April 18, 2024
    Applicant: LT MATERIALS CO., LTD.
    Inventors: Dong Jin LEE, Gi Back LEE, Won Jang JEONG, Dong Jun KIM
  • Patent number: 11961794
    Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: April 16, 2024
    Assignee: Amikor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Ji Young Chung
  • Publication number: 20240120262
    Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
  • Patent number: 11948440
    Abstract: The present disclosure relates to a system and method for predicting and detecting the outbreak of a fire.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: April 2, 2024
    Assignee: FS, Inc
    Inventors: Young Jin Kim, Gi Ryung Kwon, Si Young Choi
  • Publication number: 20240106222
    Abstract: An embodiment of the present disclosure provides an arc risk management method comprising: pre-processing measurement values of currents flowing into an electric apparatus; estimating a level of arc energy in the electric apparatus by inputting the measurement values into one artificial intelligence network comprising a first layer including a dilated convolutional neural network and a second layer including a recurrent neural network; and indicating an arc risk to the electric apparatus in a quantitative way according to the level of arc energy.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 28, 2024
    Applicant: Korea Institute of Energy Research
    Inventors: Yoon Dong SUNG, Gi Hwan YOON, Kuk-Yeol BAE, Suk In PARK, Mo Se KANG, Hak Geun JEONG, Hye Jin KIM
  • Publication number: 20240096766
    Abstract: In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: September 17, 2022
    Publication date: March 21, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Byong Jin KIM, Gi Jeong KIM
  • Publication number: 20240096725
    Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 18, 2023
    Publication date: March 21, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dae Young PARK, Byong Jin KIM, Gi Jeong KIM, Hyeong Il JEON, Kwang Soo SANG, Jin Young KHIM
  • Publication number: 20240097799
    Abstract: Disclosed is an amplification circuit, which includes a first amplifier that receives an external signal and performs first band pass filtering on the external signal to output a first filter signal, and a second amplifier that receives the first filter signal and performs second band pass filtering on the first filter signal to output a second filter signal, and a frequency pass bandwidth of the second band pass filtering is narrower than a frequency pass bandwidth of the first band pass filtering.
    Type: Application
    Filed: June 26, 2023
    Publication date: March 21, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Kyung Hwan PARK, Mi Jeong PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In Gi LIM
  • Publication number: 20240088059
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Patent number: 11923882
    Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: March 5, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Tae Wook Kang, Sung Eun Kim, Hyung-Il Park, Jae-Jin Lee, Hyuk Kim, Kyung Hwan Park, Mi Jeong Park, Kyung Jin Byun, Kwang Il Oh, In Gi Lim
  • Patent number: 11524036
    Abstract: Provided is a composition including mesenchymal stem cells as an effective ingredient for prevention, alleviation, or treatment of thyroid-associated ophthalmopathy. A pharmaceutical composition including mesenchymal stem cells as an effective ingredient for treatment of thyroid-associated ophthalmopathy allows patients with thyroid-associated ophthalmopathy to recover from an abnormal increase in hyaluronic acid production in orbital fibroblasts, increased adipocyte differentiation, and increased lipid accumulation, and thus may be useful for the treatment of thyroid-associated ophthalmopathy.
    Type: Grant
    Filed: August 16, 2018
    Date of Patent: December 13, 2022
    Assignee: SUNGKWANG MEDICAL FOUNDATION
    Inventors: He Len Lew, Mi Ra Park, Gi Jin Kim
  • Publication number: 20220010280
    Abstract: Provided is a composition for inhibiting, preventing, alleviating, or treating adipogenesis. Mesenchymal stem cells according to one aspect or a composition comprising the same inhibit fat accumulation or adipose tissue increase and thus may be advantageously utilized in the prevention, treatment, or alleviation of diseases associated with abnormal fat metabolism.
    Type: Application
    Filed: November 22, 2019
    Publication date: January 13, 2022
    Applicants: CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION, SUNGKWANG MEDICAL FOUNDATION
    Inventors: Gi Jin KIM, Jae Yeon KIM, He Len LEW
  • Publication number: 20200246392
    Abstract: Provided is a composition including mesenchymal stem cells as an effective ingredient for prevention, alleviation, or treatment of thyroid-associated ophthalmopathy. A pharmaceutical composition including mesenchymal stem cells as an effective ingredient for treatment of thyroid-associated ophthalmopathy allows patients with thyroid-associated ophthalmopathy to recover from an abnormal increase in hyaluronic acid production in orbital fibroblasts, increased adipocyte differentiation, and increased lipid accumulation, and thus may be useful for the treatment of thyroid-associated ophthalmopathy.
    Type: Application
    Filed: August 16, 2018
    Publication date: August 6, 2020
    Applicant: SUNGKWANG MEDICAL FOUNDATION
    Inventors: He Len LEW, Mi Ra PARK, Gi Jin KIM
  • Publication number: 20180296608
    Abstract: The present invention can improve or recover ovarian functions of mammals by containing spheroidal cell aggregates including placenta-derived mesenchymal stem cells as an active ingredient.
    Type: Application
    Filed: September 27, 2016
    Publication date: October 18, 2018
    Inventors: Tae-Hee KIM, SangHoon LEE, Gi Jin KIM, Ji Young HWANG, Jong Ho CHOI, Yesl JUN
  • Publication number: 20100112697
    Abstract: The present invention provides a method for isolating mesenchymal stem cells derived from a placental chorionic plate membrane, the method including: (a) harvesting a chorionic plate membrane from a detached placenta; (b) harvesting cells present in the chorionic plate membrane obtained in step (a) by scraping; (c) adding a solution containing trypsin and ethylenediaminetetraacetate to the cells obtained in step (b) to perform an enzymatic reaction and adding a fetal bovine serum thereto to terminate the enzymatic reaction; and (d) centrifuging the reaction solution obtained in step (c) and culturing the obtained cells in a medium containing a fetal bovine serum and an antibiotic.
    Type: Application
    Filed: October 24, 2007
    Publication date: May 6, 2010
    Applicants: CHABIO & DIOSTECH CO., LTD., COLLEGE OF MEDICINE POCHON CHA UNIVERSITY INDUSTRY
    Inventors: Gi-Jin Kim, Kyung-Sun Shin, Kyu-Hwan Na, Hyung-Min Chung