Patents by Inventor Gi-Jun PARK

Gi-Jun PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for reproducing video data
    Patent number: 10158888
    Abstract: A method and an apparatus for reproducing video data are provided. The method includes the steps of extracting a coded video data stream and video data attribute information from the stored video file, extracting samples relevant to an expanded time layer from the extracted video data stream on the basis of the location information of the sample which allows for temporal layer access contailed in the video data attribute information, and restoring and reproducing the extracted samples.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: December 18, 2018
    Assignees: Samsung Electronics Co., Ltd., University-Industry Cooperation Group of Kyung Hee University
    Inventors: Sung-Ryeul Rhyu, Kyung-Mo Park, Yiling Xu, Gi-Jun Park, Jang-Won Lee, Kyu-Heon Kim, Gwang-Hoon Park, Doug-Young Suh
  • Substrate of semiconductor package and method of fabricating semiconductor package using the same
    Patent number: 9082871
    Abstract: A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: July 14, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gi-Jun Park, Won-Keun Kim, Teak-Hoon Lee, Chang-Seong Jeon, Young-Kun Jee
  • SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20150155259
    Abstract: A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
    Type: Application
    Filed: February 11, 2015
    Publication date: June 4, 2015
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Gi-Jun PARK, Won-Keun KIM, Teak-Hoon LEE, Chang-Seong JEON, Young-Kun JEE
  • METHOD AND APPARATUS FOR REPRODUCING VIDEO DATA
    Publication number: 20150085940
    Abstract: A method and an apparatus for reproducing video data are provided. The method includes the steps of extracting a coded video data stream and video data attribute information from the stored video file, extracting samples relevant to an expanded time layer from the extracted video data stream on the basis of the location information of the sample which allows for temporal layer access contailed in the video data attribute information, and restoring and reproducing the extracted samples.
    Type: Application
    Filed: April 25, 2013
    Publication date: March 26, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-Ryeul Rhyu, Kyung-Mo Park, Yiling Xu, Gi-Jun Park, Jang-Won Lee, Kyu-Heon Kim, Gwang-Hoon Park, Doug-Young Suh
  • Substrate of semiconductor package and method of fabricating semiconductor package using the same
    Patent number: 8987904
    Abstract: A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: March 24, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gi-Jun Park, Won-Keun Kim, Teak-Hoon Lee, Chang-Seong Jeon, Young-Kun Jee
  • METHOD FOR DISPLAYING CONTENTS, METHOD FOR PROVIDING CONTENTS, CONTENTS DISPLAY DEVICE AND CONTENTS PROVIDING DEVICE
    Publication number: 20140250206
    Abstract: Methods and devices for displaying content are provided. A method for displaying content includes: receiving the content from a server and displaying the received content; and, in response to a request by an external device distinct from the server, transmitting display time information of the displayed content to the external device.
    Type: Application
    Filed: February 26, 2014
    Publication date: September 4, 2014
    Applicants: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-seok JANG, Kyu-heon KIM, Jung-wook PARK, Jae-jun LEE, Hong-seok PARK, Gwang-Hoon PARK, Gi-jun PARK, Doug-Young SUH, Jang-won LEE
  • SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20140008794
    Abstract: A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
    Type: Application
    Filed: May 23, 2013
    Publication date: January 9, 2014
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Gi-Jun PARK, Won-Keun KIM, Teak-Hoon LEE, Chang-Seong JEON, Young-Kun JEE