Patents by Inventor Gi-Jung Nam

Gi-Jung Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177888
    Abstract: Disclosed is the present disclosure relates to a marine cable for offshore wind power having an improved water-tree property. More particularly, it relates to a marine cable for offshore wind power, which may effectively suppress formation of water trees caused by diffusion of moisture, having penetrated into cores of the cable, in insulating layers so as to improve dielectric strength and consequently secure a long lifespan.
    Type: Application
    Filed: October 9, 2023
    Publication date: May 30, 2024
    Inventors: Hyun Jung JUNG, Gi Joon NAM, Kyoung Soo KIM, Yi Seul YANG
  • Publication number: 20080047663
    Abstract: An anisotropic conductive film bonding apparatus and a method using a laser beam instead of thermal welding using a hot bar are disclosed. The apparatus includes a light source for generating a laser beam, a laser beam transmitter for guiding the laser beam from the light source to project the laser beam onto a connecting portion, a jig, on which the substrate, the ACF, and the material are accumulated, for projecting the laser beam on the accumulated material, a manipulation panel, and a controller for setting intensity and projection manner of the laser beam and pressure and for controlling overall operation of the apparatus.
    Type: Application
    Filed: October 24, 2007
    Publication date: February 28, 2008
    Applicant: Jettech Ltd.
    Inventors: Gi-Jung Nam, No-Heung Kwak
  • Publication number: 20070215584
    Abstract: In a method and apparatus for bonding an electronic element to a substrate, a laser beam is generated, pressure is applied to the substrate, a connecting medium, and an electronic element, which are stacked, and the electronic element is bonded to the substrate through heat fusion of the connecting medium by fusing the connecting medium by irradiating the laser beam to the substrate and the electronic element while applying pressure to the substrate, the connecting medium, and the electronic element. The laser beam of a line type or an area type has uniform quality through use of a homogenizer. The laser beam is output in a continuity mode at an initial stage, and is output in a pulse mode at a fusing stage.
    Type: Application
    Filed: March 19, 2007
    Publication date: September 20, 2007
    Inventors: Gi-Jung Nam, No-Heung Kwak
  • Publication number: 20060196600
    Abstract: An anisotropic conductive film bonding apparatus and a method using a laser beam instead of thermal welding using a hot bar are disclosed. The apparatus includes a light source for generating a laser beam, a laser beam transmitter for guiding the laser beam from the light source to project the laser beam onto a connecting portion, a jig, on which the substrate, the ACF, and the material are accumulated, for projecting the laser beam on the accumulated material, a manipulation panel, and a controller for setting intensity and projection manner of the laser beam and pressure and for controlling overall operation of the apparatus.
    Type: Application
    Filed: March 3, 2005
    Publication date: September 7, 2006
    Inventors: Gi-Jung Nam, No-Heung Kwak