Abstract: A plasma processing system. The system may include a vacuum chamber including an electron emission region and a processing region, in which plasma is produced and a substrate is loaded, the electron emission region having a first pressure and the processing region being maintained to a pressure higher than the first pressure, a thermal electron emission unit provided in the electron emission region and used to emit a thermal electron, a grid electrode grounded and used to selectively provide an electron emitted from the thermal electron emission unit to the processing region, a substrate holder provided in a lower region of the vacuum chamber and in the processing region, the substrate holder being used to load the substrate thereon, and an RF power source configured to apply an RF power to the substrate holder and to produce the plasma.

Abstract: A plasma generating apparatus and a substrate processing apparatus are disclosed. The plasma generating apparatus includes a disk-shaped first electrode receiving first RF power of a first frequency to generate plasma, a washer-type second electrode disposed around the circumference of the first electrode and receiving second RF power of a second frequency, an insulating spacer disposed between the first electrode and the second electrode, a first RF power source supplying power to the first electrode, and a second RF power source supplying power to the second electrode.