Abstract: A measurement carrier includes a housing having an internal space, and a flow-rate measuring device located within the internal space. A bottom surface of the housing includes a first inflow hole, a second inflow hole, and an outflow hole, which provide fluid communication between the internal space and an outer space. The flow-rate measuring device may include a first flow-rate measuring sensor in fluid communication with the first inflow hole, and a second flow-rate measuring sensor in fluid communication with the second inflow hole.

Abstract: A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

Abstract: A measurement carrier includes a housing having an internal space, and a flow-rate measuring device located within the internal space. A bottom surface of the housing includes a first inflow hole, a second inflow hole, and an outflow hole, which provide fluid communication between the internal space and an outer space. The flow-rate measuring device may include a first flow-rate measuring sensor in fluid communication with the first inflow hole, and a second flow-rate measuring sensor in fluid communication with the second inflow hole.

Abstract: A semiconductor wafer storage system includes a container that provides a space in which a semiconductor wafer is to be stored, a fluid supply that provides a fluid to the container, a connection part that receives the fluid from the fluid supply and transfers the fluid to the container, and a nozzle part that connects the connection part to the container. The container may include a coupling plate to which the nozzle part is coupled, and the nozzle part may include a first nozzle and a second nozzle.

Abstract: A semiconductor wafer storage system includes a container that provides a space in which a semiconductor wafer is to be stored, a fluid supply that provides a fluid to the container, a connection part that receives the fluid from the fluid supply and transfers the fluid to the container, and a nozzle part that connects the connection part to the container. The container may include a coupling plate to which the nozzle part is coupled, and the nozzle part may include a first nozzle and a second nozzle.

Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.

Abstract: A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.

Abstract: A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

Abstract: An arc discharge apparatus includes a body unit including a housing and a transmissive member fixed to the housing, the housing having a coolant inlet and a coolant outlet, and an electrode unit on the housing, the electrode unit including an anode and a cathode facing each other, wherein the anode includes a main body portion connected to the housing, an anode tip coupled to the main body portion, and a cooling line in the anode and in contact with an inner wall of the anode tip, the cooling line being connected to the coolant inlet and to the coolant outlet.