Patents by Inventor Gi Su CHI

Gi Su CHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device module and method of manufacturing the same
    Patent number: 11430742
    Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: August 30, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong In Ryu, Suk Youn Hong, Gi Su Chi, Seung Hyun Hong, Ki Chan Kim
  • Electronic device module and method of manufacturing the same
    Patent number: 11251135
    Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: February 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong In Ryu, Suk Youn Hong, Gi Su Chi, Seung Hyun Hong, Ki Chan Kim
  • ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200098699
    Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong In RYU, Suk Youn HONG, Gi Su CHI, Seung Hyun HONG, Ki Chan KIM
  • ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190304926
    Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
    Type: Application
    Filed: November 6, 2018
    Publication date: October 3, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong In RYU, Suk Youn HONG, Gi Su CHI, Seung Hyun HONG, Ki Chan KIM