Patents by Inventor Gi Sub Lee

Gi Sub Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9142499
    Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: September 22, 2015
    Assignee: SAMSUNG ELECTRO-MACHANICS CO., LTD.
    Inventors: Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Gi Sub Lee, Jin Won Choi
  • Publication number: 20140291851
    Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
    Type: Application
    Filed: June 11, 2014
    Publication date: October 2, 2014
    Inventors: Ki Taek LEE, Hueng Jae OH, Sung Won JEONG, Gi Sub LEE, Jin Won CHOI
  • Patent number: 8822841
    Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: September 2, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Gyu Lee, Jin Won Choi, Sung Won Jeong, Dae Young Lee, Gi Sub Lee, Jin Ho Kim
  • Patent number: 8766450
    Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: July 1, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Gi Sub Lee, Jin Won Choi
  • Publication number: 20120267285
    Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.
    Type: Application
    Filed: March 2, 2012
    Publication date: October 25, 2012
    Inventors: Dong Gyu LEE, Jin Won Choi, Sung Won Jeong, Dae Young Lee, Gi Sub Lee, Jin Ho Kim
  • Publication number: 20110068473
    Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
    Type: Application
    Filed: August 5, 2010
    Publication date: March 24, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Taek Lee, Hueng Jae OH, Sung Won Jeong, Gi Sub Lee, Jin Won Choi