Patents by Inventor Gi Wan KIM

Gi Wan KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250087546
    Abstract: In one example, an electronic device includes a substrate, an electronic component disposed over the substrate, and an encapsulant disposed over the substrate and the electronic component. A molded heat spreader can be disposed over the encapsulant and can comprise a heat spreader and a mold compound disposed around a lateral side of the heat spreader. A lateral side of the mold compound is coplanar with a lateral side of the encapsulant. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 13, 2025
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Joon Dong Kim, Gi Tae Lim, Gi Jeong Kim, Min Hwa Chang, Gyu Wan Han, Hwi Won Yun
  • Patent number: 12217357
    Abstract: A method of controlling a display device includes rendering a plurality of viewpoint images, generating a plurality of sub-images based on the plurality of viewpoint images and a plurality of mapping pattern images corresponding to the plurality of viewpoint images, generating a single light-field image based on the plurality of sub-images, and outputting the single light-field image.
    Type: Grant
    Filed: March 22, 2024
    Date of Patent: February 4, 2025
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Rang Kyun Mok, Ji Young Choi, Gi Seok Kwon, Jae Joong Kwon, Beom Shik Kim, Jae Wan Park
  • Publication number: 20250022784
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 11632342
    Abstract: A messenger application for a second account related to at least one account in an instant messaging service receives, from a server, a list of at least one first account for which a video is registered and recommends a first account using a list view that shows the list of the at least one first account distinguished from a list of the at least one account.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: April 18, 2023
    Assignee: KAKAO CORP.
    Inventors: Hyo Jin Ham, Seung Bo Cho, Eun Lee, Hyo Joo Park, Gi Wan Kim, Eung Ju Park
  • Publication number: 20200328994
    Abstract: A messenger application for a second account related to at least one account in an instant messaging service receives, from a server, a list of at least one first account for which a video is registered and recommends a first account using a list view that shows the list of the at least one first account distinguished from a list of the at least one account.
    Type: Application
    Filed: April 10, 2020
    Publication date: October 15, 2020
    Inventors: Hyo Jin HAM, Seung Bo CHO, Eun LEE, Hyo Joo PARK, Gi Wan KIM, Eung Ju PARK