Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A method and apparatus for a remittance service are disclosed. An operation method of a server providing a remittance service includes receiving, from a remitter participating in an anonymous chatroom by using a first temporary profile, a request for a remittance to a second temporary profile participating in the anonymous chatroom, verifying a remittance qualification of an account of the remitter, generating remittance transaction information for remitting an amount corresponding to the remittance request to an account of a remittee corresponding to the second temporary profile, and transmitting, to the account of the remittee a remittance notification including information on the first temporary profile as remitter information.