Patents by Inventor Gi Woo Lee
Gi Woo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Publication number: 20240120262Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Publication number: 20240105934Abstract: A positive electrode active material for a lithium secondary battery has a mixture of microparticles having a predetermined average particle size (D50) and macroparticles having a larger average particle size (D50) than the microparticles. The microparticles have the average particle size (D50) of 1 to 10 ?m and are at least one selected from the group consisting of particles having a carbon material coating layer on all or part of a surface of primary macroparticles having an average particle size (D50) of 1 ?m or more, particles having a carbon material coating layer on all or part of a surface of secondary particles formed by agglomeration of the primary macroparticles, and a mixture thereof. The macroparticles are secondary particles having an average particle size (D50) of 5 to 20 ?m formed by agglomeration of primary microparticles having a smaller average particle size (D50) than the primary macroparticles.Type: ApplicationFiled: June 9, 2022Publication date: March 28, 2024Applicant: LG Energy Solution, Ltd.Inventors: Gi-Beom Han, Jong-Woo Kim, Eun-Sol Lho, Kang-Joon Park, Min Kwak, Seul-Ki Kim, Hyeong-Il Kim, Sang-Min Park, Sang-Wook Lee, Wang-Mo Jung
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Publication number: 20240088059Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
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Patent number: 11794515Abstract: A device configured for coupling a resonator to a vehicle wheel, may include an annular first strap assembled with an external circumferential surface of the wheel rim and fixing positions of resonators disposed on the external circumferential surface of the wheel rim; and an annular second strap surrounding second flanges formed at second edge portions of the resonators based on an axial direction of the wheel rim and pressurizing the second flange toward the external circumferential surface of the wheel rim after first flanges, which are formed on second edge portions of the resonators based on an axial direction of the wheel rim, are inserted between the first strap and the external circumferential surface of the wheel rim.Type: GrantFiled: December 1, 2020Date of Patent: October 24, 2023Assignees: Hyundai Motor Company, Kia Motors Corporation, SHINWOOSHIN CO., LTD., HANDS CORPORATION Ltd., KWANG SUNG CORPORATION LTDInventors: Doo Seek Park, Eun Sang Ryu, Hyeong Seop Kim, Moon Seok Hwang, Gi Woo Lee, Hyung Ki Yoon, Kwang Hyun Cho, Jae Woo Sung, Soon Shik Kim, Young Sik Kim
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Publication number: 20210309048Abstract: A device configured for coupling a resonator to a vehicle wheel, may include an annular first strap assembled with an external circumferential surface of the wheel rim and fixing positions of resonators disposed on the external circumferential surface of the wheel rim; and an annular second strap surrounding second flanges formed at second edge portions of the resonators based on an axial direction of the wheel rim and pressurizing the second flange toward the external circumferential surface of the wheel rim after first flanges, which are formed on second edge portions of the resonators based on an axial direction of the wheel rim, are inserted between the first strap and the external circumferential surface of the wheel rimType: ApplicationFiled: December 1, 2020Publication date: October 7, 2021Applicants: Hyundai Motor Company, Kia Motors Corporation, SHINWOOSHIN CO., LTD., HANDS CORPORATION Ltd., KWANG SUNG CORPORATION LTDInventors: Doo Seek PARK, Eun Sang RYU, Hyeong Seop KIM, Moon Seok HWANG, Gi Woo LEE, Hyung Ki YOON, Kwang Hyun CHO, Jae Woo SUNG, Soon Shik KIM, Young Sik KIM
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Patent number: 9434682Abstract: Disclosed are a novel reactive mesogen compound having superior thermostability, high birefringence and a simple preparation process while possessing unique liquid crystal characteristics having molecular orientation by forming a polymer network through photopolymerization, and a method of preparing the same. The novel reactive mesogen compound according to the present invention is represented by Formula 3 below.Type: GrantFiled: July 22, 2015Date of Patent: September 6, 2016Assignee: Aekyung Chemical Co., Ltd.Inventors: Yoon-Tae Jeon, Do-Yeon Kim, Yun-Sun Do, Gi-Woo Lee, Hueong-Nam Park, Kwang-Sik Choi
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Publication number: 20150361033Abstract: Disclosed are a novel reactive mesogen compound having superior thermostability, high birefringence and a simple preparation process while possessing unique liquid crystal characteristics having molecular orientation by forming a polymer network through photopolymerization, and a method of preparing the same. The novel reactive mesogen compound according to the present invention is represented by Formula 3 below.Type: ApplicationFiled: July 22, 2015Publication date: December 17, 2015Inventors: Yoon-Tae Jeon, Do-Yeon Kim, Yun-Sun Do, Gi-Woo Lee, Hueong-Nam Park, Kwang-Sik Choi
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Publication number: 20120301605Abstract: There are provided a gravure printing engraving roll and a manufacturing method thereof. The gravure printing engraving roll includes: a base layer provided with gravure printing patterns; and a reinforcement coating layer applied to the base layer in order to reinforce strength of the base layer, the reinforcement coating layer including a first reinforcement layer formed on the base layer by a wet plating method, a second reinforcement layer forming an outer surface of the reinforcement coating layer, a first adhesive layer disposed between the first and second reinforcement layers and providing adhesive strength to a surface of the first reinforcement layer, and a second adhesive layer providing adhesive strength between the first adhesive layer and the second reinforcement layer.Type: ApplicationFiled: May 17, 2012Publication date: November 29, 2012Inventors: Tae Hyeong KIM, Gee Lyong KIM, Young Ha JUN, Gi Woo LEE, Ki Ho YEO, Jai Moo YOO
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Patent number: 8264815Abstract: A multilayer ceramic capacitor includes: a ceramic element; a plurality of first and second inner electrodes formed at the interior of the ceramic element and including capacity contribution portions facing each other and capacity non-contribution portions extending from the capacity contribution portions and having one end alternately exposed from the side of the ceramic element; first and second outer electrodes formed at the side of the ceramic main body and electrically connected with the first and second inner electrodes, wherein the thickness of the capacity non-contribution portion is greater than that of the capacity contribution portion and connectivity of the capacity non-contribution portion is higher than that of the capacity contribution portion at one or more of the first and second inner electrodes.Type: GrantFiled: July 28, 2010Date of Patent: September 11, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyea Sun Yun, Gee Lyong Kim, Doo Young Kim, Gi Woo Lee, Dong Ik Chang
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Publication number: 20110141656Abstract: A multilayer ceramic capacitor includes: a ceramic element; a plurality of first and second inner electrodes formed at the interior of the ceramic element and including capacity contribution portions facing each other and capacity non-contribution portions extending from the capacity contribution portions and having one end alternately exposed from the side of the ceramic element; first and second outer electrodes formed at the side of the ceramic main body and electrically connected with the first and second inner electrodes, wherein the thickness of the capacity non-contribution portion is greater than that of the capacity contribution portion and connectivity of the capacity non-contribution portion is higher than that of the capacity contribution portion at one or more of the first and second inner electrodes.Type: ApplicationFiled: July 28, 2010Publication date: June 16, 2011Inventors: Hyea Sun Yun, Gee Lyong Kim, Doo Young Kim, Gi Woo Lee, Dong Ik Chang
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Publication number: 20100320400Abstract: The present invention relates to an exposure device. There is provided an exposure device including: a case; a plurality of LEDs that are received inside the case and emit light in an UV wavelength range straightly to the outside; and a power supplier that supplies power applied to the LEDs.Type: ApplicationFiled: August 19, 2009Publication date: December 23, 2010Inventors: Yong Hyun Jin, Young Tae Kim, Gun Jung Yoon, Ji Sook Kim, Gi Woo Lee