Patents by Inventor Gi Young Hong

Gi Young Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 11332605
    Abstract: Disclosed is a thermoplastic elastomer composition having a superior low-temperature flexibility is provided. The thermoplastic elastomer composition may include an amount of about 10 to 15 wt % of a polypropylene-ethylene copolymer; an amount of about 70 to 85 wt % of a thermoplastic elastomer including an olefin-based thermoplastic elastomer and a styrene-based thermoplastic elastomer; an amount of about 5 to 10 wt % of a softener; an amount of about 3 to 5 wt % of a reinforcing agent; and an amount of about 1 wt % or less but greater than 0 wt % of a UV stabilizer based on the total weight of the thermoplastic elastomer composition.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: May 17, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation, GS Caltex Corporatoin
    Inventors: Jin Gi Ahn, Boo Youn An, Dae Sik Kim, Kyeong Hoon Jang, In Soo Han, Seul Yi, Hyun Woo Kwon, Byung Wook Kang, Gyeong Suk Yoo, Gi Young Hong
  • Publication number: 20200392322
    Abstract: Disclosed is a thermoplastic elastomer composition having a superior low-temperature flexibility is provided. The thermoplastic elastomer composition may include an amount of about 10 to 15 wt % of a polypropylene-ethylene copolymer; an amount of about 70 to 85 wt % of a thermoplastic elastomer including an olefin-based thermoplastic elastomer and a styrene-based thermoplastic elastomer; an amount of about 5 to 10 wt % of a softener; an amount of about 3 to 5 wt % of a reinforcing agent; and an amount of about 1 wt % or less but greater than 0 wt % of a UV stabilizer based on the total weight of the thermoplastic elastomer composition.
    Type: Application
    Filed: October 3, 2019
    Publication date: December 17, 2020
    Inventors: Jin Gi Ahn, Boo Youn An, Dae Sik Kim, Kyeong Hoon Jang, In Soo Han, Seul Yi, Hyun Woo Kwon, Byung Wook Kang, Gyeong Suk Yoo, Gi Young Hong