Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.

Abstract: Disclosed is a method and apparatus for extracting data in a deep learning model. The method includes receiving an input query, determining a first decision boundary set being a subset of a decision boundary set corresponding to a target layer of the deep learning model, extracting a decision region including the input query based on the first decision boundary set, and extracting data included in the decision region.

Abstract: Disclosed is a method and apparatus for extracting data in a deep learning model. The method includes receiving an input query, determining a first decision boundary set being a subset of a decision boundary set corresponding to a target layer of the deep learning model, extracting a decision region including the input query based on the first decision boundary set, and extracting data included in the decision region.

Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.

Abstract: A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.

Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.

Abstract: A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.