Abstract: A semiconductor memory device includes a third insulating pattern and a first insulating pattern on a substrate, the third insulating pattern and the first insulating pattern being spaced apart from each other in a first direction that is perpendicular to the substrate such that a bottom surface of the third insulating pattern and a top surface of the first insulating pattern face each other, a gate electrode between the bottom surface of the third insulating pattern and the top surface of the first insulating pattern, and including a first side extending between the bottom surface of the third insulating pattern and the top surface of the first insulating pattern, and a second insulating pattern that protrudes from the first side of the gate electrode by a second width in a second direction, the second direction being different from the first direction.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.

Abstract: An optical member including a light guide plate including an upper surface, a lower surface facing the upper surface, a first side surface disposed between the upper surface and the lower surface, a first inclined surface disposed between the upper surface and the first side surface, and a second inclined surface disposed between the lower surface and the first side surface, and a first reflective member including a first side portion covering the first side surface, a first folded portion extending from the first side portion to one side thereof and covering the first inclined surface, and a second folded portion extending from the first side portion to the other side thereof and covering the second inclined surface, in which the first reflective member includes a reflective layer having at least one curved surface.

Abstract: A display device includes a light guide plate; a light source facing a first side surface of the light guide plate; a display panel located on the light guide plate; and a coupling member located between the light guide plate and the display panel to couple the light guide plate with the display panel. The coupling member includes a first light transmission blocking tape having a first portion along an edge portion of an upper surface of the light guide plate and a second portion extending from the first portion and coupled to a side surface other than the first side surface of the light guide plate, and a coupling tape located on the first portion of the first light transmission blocking tape and coupled to the first light transmission blocking tape.

Abstract: A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.

Abstract: A display device includes a light guide plate; a light source facing a first side surface of the light guide plate; a display panel located on the light guide plate; and a coupling member located between the light guide plate and the display panel to couple the light guide plate with the display panel. The coupling member includes a first light transmission blocking tape having a first portion along an edge portion of an upper surface of the light guide plate and a second portion extending from the first portion and coupled to a side surface other than the first side surface of the light guide plate, and a coupling tape located on the first portion of the first light transmission blocking tape and coupled to the first light transmission blocking tape.

Abstract: A display device includes: a display panel; a mold frame which supports the display panel, where the mold frame includes a frame body comprises a recessed portion, and a first light-transmit member extending in a first direction and at least partially inserted into the recessed portion; and a joining member which couples the display panel and the mold frame to each other, where the first light-transmit member and the joining member at least partially overlap each other.