Abstract: A modulation device may include a variable burst regulator and a current-driven clock generator. The modulation device may include a first output terminal configured to provide a modulated voltage for an operating frequency over a modulation period. The current-driven clock generator may include a second input terminal configured to receive a buffered version of the modulated voltage. The current-driven clock generator may include a second output terminal configured to provide a modulated current during the modulation period. The operating frequency may be proportional to the modulated current. The operating frequency may control the operating frequency over the modulation period.

Abstract: A converter includes a transformer having a primary and secondary windings. The primary winding has first and second winding terminals. A switch network has first-sixth switch network terminals. The first switch network terminal couples to the first winding terminal. The second switch network terminal couples to the second winding terminal. A first transistor has a first control input and first and second current terminals. The second current terminal couples to the third switch network terminal. A second transistor has a second control input and third and fourth current terminals. The fourth current terminal couples to the fourth switch network terminal. A third transistor has a third control input and fifth and sixth current terminals. The fifth current terminal couples to the fifth switch network terminal. A fourth transistor has a fourth control input and seventh and eighth current terminals. The seventh current terminal couples to the sixth switch network terminal.

Abstract: In examples, a packaged integrated circuit (IC) comprises a package substrate having opposite first and second surfaces and including metal interconnects surrounded by an insulation material. The package substrate includes a depression region that extends from the first surface, and the depression region includes a material different from the insulation material and the metal interconnects. The packaged IC also comprises a semiconductor die on part of the first surface adjacent to the depression region. The semiconductor die includes circuitry coupled to the metal interconnects. The packaged IC also comprises a mold compound covering the semiconductor die and the depression region.

Abstract: A package substrate includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the package substrate and includes a first contact pad coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the package substrate and includes a second contact pad coupled to the second circuit element.

Abstract: A modulation device may include a variable burst regulator and a current-driven clock generator. The modulation device may include a first output terminal configured to provide a modulated voltage for an operating frequency over a modulation period. The current-driven clock generator may include a second input terminal configured to receive a buffered version of the modulated voltage. The current-driven clock generator may include a second output terminal configured to provide a modulated current during the modulation period. The operating frequency may be proportional to the modulated current. The operating frequency may control the operating frequency over the modulation period.

Abstract: A converter includes a transformer having a primary and secondary windings. The primary winding has first and second winding terminals. A switch network has first-sixth switch network terminals. The first switch network terminal couples to the first winding terminal. The second switch network terminal couples to the second winding terminal. A first transistor has a first control input and first and second current terminals. The second current terminal couples to the third switch network terminal. A second transistor has a second control input and third and fourth current terminals. The fourth current terminal couples to the fourth switch network terminal. A third transistor has a third control input and fifth and sixth current terminals. The fifth current terminal couples to the fifth switch network terminal. A fourth transistor has a fourth control input and seventh and eighth current terminals. The seventh current terminal couples to the sixth switch network terminal.

Abstract: An apparatus includes a substrate. A first conductive layer is on the substrate. The first conductive layer includes a first set of conductive segments and a second set of conductive segments. A second conductive layer is over the first conductive layer opposite the substrate. The second metal layer includes a third set of conductive segments and a fourth set of conductive segments. A first set of vias is between the first set of conductive segments and the third set of conductive segments. The first set of conductive segments, the third set of conductive segments, and the first set of vias form a first transformer winding. A second set of vias is between the second set of conductive segments and the fourth set of conductive segments. The second set of conductive segments, the fourth set of conductive segments, and the second set of vias form a second transformer winding.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

Abstract: An integrated circuit (IC) assembly includes a first power stage adapted to receive an input voltage and a second power stage adapted to provide an isolated output voltage. The IC also includes a transformer coupled between the first and second power stages. The IC further includes a detuning circuit coupled to the transformer, and a receiver circuit coupled to the first power stage. The receiver circuit includes an integrator configured to integrate a switching signal within the first power stage.

Abstract: A rectifier circuit includes a first diode-connected transistor coupled to a first voltage terminal and a second diode-connected transistor coupled to a second voltage terminal. A switch network is coupled between the first diode-connected transistor and the second diode-connected transistor. The switch network has a first switch network terminal adapted to be coupled to a first terminal of a secondary winding of a transformer and has a second switch network terminal adapted to be coupled to a second terminal of the secondary winding of the transformer.

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

Abstract: Disclosed examples include isolated load switch driver circuits to drive a load, including an impedance circuit that receives a digital input voltage signal from a signal source, and selectively allows a current signal to flow from the signal source to charge a buffer capacitor. An impedance control circuit controls the impedance circuit to limit the current signal in response to the buffer capacitor reaching a first threshold voltage, and an output circuit provides an output isolated from the digital input voltage signal to switch the load. A signaling circuit selectively enables the output circuit to draw power from the buffer capacitor in response to the voltage of the buffer capacitor reaching the first threshold voltage.

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

Abstract: Disclosed examples include isolated load switch driver circuits to drive a load, including an impedance circuit that receives a digital input voltage signal from a signal source, and selectively allows a current signal to flow from the signal source to charge a buffer capacitor. An impedance control circuit controls the impedance circuit to limit the current signal in response to the buffer capacitor reaching a first threshold voltage, and an output circuit provides an output isolated from the digital input voltage signal to switch the load. A signaling circuit selectively enables the output circuit to draw power from the buffer capacitor in response to the voltage of the buffer capacitor reaching the first threshold voltage.

Abstract: A switched voltage converter may be controlled with load current feedforward control loop in addition to an output voltage feedback loop. The converter includes a first switch device that is controlled to open and close at a selected switching rate with a selected duty cycle. The first switch device is coupled in series with an inductor and conducts current through the inductor while the first switch is closed. A second switch device conducts current from the inductor to an output capacitor and to load while the first switch is open to produce an output voltage and a resulting load current through the load. The load current is measured in a continuous manner and a load current feedforward control signal is generated that is representative of the load current. The switch rate and/or duty cycle of the first switch is adjusted in response to the load current feedforward control signal.

Abstract: Disclosed examples include isolated load switch driver circuits to drive a load, including an impedance circuit that receives a digital input voltage signal from a signal source, and selectively allows a current signal to flow from the signal source to charge a buffer capacitor. An impedance control circuit controls the impedance circuit to limit the current signal in response to the buffer capacitor reaching a first threshold voltage, and an output circuit provides an output isolated from the digital input voltage signal to switch the load. A signaling circuit selectively enables the output circuit to draw power from the buffer capacitor in response to the voltage of the buffer capacitor reaching the first threshold voltage.

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.