Abstract: A recyclable continuous ink jet print head is provided that includes a manifold formed from a metal such as stainless steel, a die having ink jet nozzles formed from a ceramic material such as silicon, a control circuit connected to the die via microwiring, and an interposing member disposed between the manifold and the die. The interposing member is formed from a composite material such as Al—SiC having a coefficient of thermal conductivity that is higher than that of the silicon die, and a coefficient of thermal expansion (CTE) that is between that of the die and the manifold. During manufacture, the CTE value of the interposing member allows long-lasting, heat-cured epoxy compositions to be used to bond the die to the manifold and to encapsulate the microwiring between the die and a control circuit with while maintaining proper alignment of the die ink jet nozzles on the manifold.

Abstract: A method of depositing a layer onto a substrate, comprising heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited, dispensing into the evaporator one or more quantized units of the evaporant where the evaporant is completely vaporized, providing an area vapor dispenser having a plurality of apertures, and directing the vaporized evaporant from the evaporator to the area vapor dispenser so that the evaporant is dispensed through the apertures to deposit the layer on the substrate.

Abstract: A method of depositing a layer onto a substrate, comprising heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited, dispensing into the evaporator one or more quantized units of the evaporant where the evaporant is completely vaporized, providing an area vapor dispenser having a plurality of apertures, and directing the vaporized evaporant from the evaporator to the area vapor dispenser so that the evaporant is dispensed through the apertures to deposit the layer on the substrate.

Abstract: A recyclable continuous ink jet print head is provided that includes a manifold formed from a metal such as stainless steel, a die having ink jet nozzles formed from a ceramic material such as silicon, a control circuit connected to the die via microwiring, and an interposing member disposed between the manifold and the die. The interposing member is formed from a composite material such as Al—SiC having a coefficient of thermal conductivity that is higher than that of the silicon die, and a coefficient of thermal expansion (CTE) that is between that of the die and the manifold. During manufacture, the CTE value of the interposing member allows long-lasting, heat-cured epoxy compositions to be used to bond the die to the manifold and to encapsulate the microwiring between the die and a control circuit with while maintaining proper alignment of the die ink jet nozzles on the manifold.

Abstract: An organic light-emitting diode lighting apparatus having an organic light-emitting diode lamp having a thermally conductive mounting member having a mounting surface on a first side and second light-emitting surface and a thin-film light-emitting structure adjacent the second light-emitting surface, the thin-film light-emitting structure comprising an anode, a light-emitting layer, and a cathode, and a thermally conductive mounting fixture having a thermally conductive mounting surface on which the thermally conductive mounting member is secured such that there is substantially continuous thermal contact across the mounting surface.

Abstract: A method of transferring organic material from a donor element to a substrate includes providing a radiation source; and selecting the power of the radiation applied to the donor element by the radiation source to cause the transfer of organic material to the substrate wherein the time that one or more positions of the donor element receives radiation is greater than 1 millisecond.

Abstract: A donor element for transferring organic material to form an OLED device includes a transparent support, a first metallic layer responsive to radiation which passes through the transparent support to produce heat, a second metallic layer that is reactive to moisture or oxygen or both provided over the first metallic layer, and an organic layer having transferable organic material disposed over the second metallic layer which, in response to radiation absorbed by the first metallic layer, will cause the organic material to be transferred to an OLED device.

Abstract: A tiled flat panel lighting system includes flat panel light emitting units, each unit comprising a light emitting region and at least two pairs of first and second electrical contacts which are accessible external to the unit, wherein the first electrical contacts of the pairs are electrically connected within the unit, the second electrical contacts of the pairs are electrically connected within the unit, the light emitting region is electrically connected to the connected first contacts and to the connected second contacts. A plurality of units may be electrically interconnected through pairs of the externally accessible first and second electrical contacts positioned at one or more adjacent edges of each of the units.

Abstract: A method of making an OLED device that corrects for potential defect(s) identified in one processing station by adjusting a subsequent processing station includes processing an OLED substrate by adding at least one organic layer and measuring in-situ one or more parameters associated with such organic layer to produce a signal representative of potential defect(s) in a produced OLED device, and adjusting in a subsequent processing station in response to the signal to change the formation of a subsequent organic layer added to the OLED device to compensate for the potential defect(s).

Abstract: A method of improving the aperture ratio or resolution of an OLED device which includes a plurality of laterally spaced electrodes and one or more electrodes vertically spaced apart from the plurality of laterally spaced electrodes. The improvement includes providing a donor having transferable organic material in spaced relationship with the laterally spaced electrodes, and illuminating the donor with radiation in patterns corresponding to the area of the laterally spaced electrodes to transfer organic material over the laterally spaced electrodes such that substantially all of the organic material is transferred and the edge taper region of the organic material is less than 8 microns thereby permitting the reduction in spacing between the laterally spaced electrodes and improvement in the aperture ratio, the resolution, or both, of the OLED device.

Abstract: A high aperture ratio emissive tiled display comprised of a plurality of tiles including a substrate with discrete layers of integrated drive circuits, thin film transistors, circuit conductor layer and light-emitting pixel array wherein all the electronic circuitry is contained under the pixel array. Vertical interconnects are made between the drive circuits, circuits and pixel electrodes, as necessary, and can include vertical interconnections through the substrate. Large flat panel displays including at least two of said tiles are aligned to maintain pixel pitch from one tile to another to produce a seamless image.

Abstract: Making an OLED device, in a controlled environment, includes positioning a substrate having an electrode in a first station and coating one or more first organic layer(s); using a robot to grasp and remove the substrate from the first station and positioning the coated substrate into a second station, with a donor element that includes emissive organic material; applying radiation to selectively transfer organic material from the donor element to the substrate to form an emissive layer; forming a second electrode in a third station; and controlling the atmosphere in the stations so that the water vapor partial pressure is less than 1 torr but greater than 0 torr, or the oxygen partial pressure is less than 1 torr but greater than 0 torr, or both the water vapor partial pressure and the oxygen partial pressure are respectively less than 1 torr but greater than 0 torr.

Abstract: A display including at least two tiles which are aligned along one edge of each tile but are spaced from each other, each tile having electric field activatable pixels which produce light, each tile including and are spaced from their aligned edge, and a back plate aligned with the two tiles and having electric field activatable pixels which are disposed so that they are positioned in the space provided between the aligned tiles whereby, when pixels on the two tiles and the back plate are activated, a seamless image is produced.

Abstract: A method of making a tiled emissive display having at least two aligned tiles including finishing at least one edge of each tile and aligning the finished edges of such tiles and forming a monolithic structure including aligned tiles, each such aligned tile having a substrate, TFT circuits, drive circuits and bottom pixel electrodes for providing electrical signals to pixels in the corresponding tile. The method also includes coating the aligned tiles with material that produces light when activated by an electric field and forming at least one top pixel electrode over the coated material so that the coated material produces light when activated by an electric field from the electrode.

Abstract: A method of making a tiled emissive display having at least two aligned tiles including finishing at least one edge of each tile and aligning the finished edges of such tiles and forming a monolithic structure including aligned tiles, each such aligned tile having a substrate, TFT circuits, drive circuits and bottom pixel electrodes for providing electrical signals to pixels in the corresponding tile. The method also includes coating the aligned tiles with material that produces light when activated by an electric field and forming at least one top pixel electrode over the coated material so that the coated material produces light when activated by an electric field from the electrode.

Abstract: A high aperture ratio emissive tiled display comprised of a plurality of tiles including a substrate with discrete layers of integrated drive circuits, thin film transistors, circuit conductor layer and light-emitting pixel array wherein all the electronic circuitry is contained under the pixel array. Vertical interconnects are made between the drive circuits, circuits and pixel electrodes, as necessary, and can include vertical interconnections through the substrate. Large flat panel displays including at least two of said tiles are aligned to maintain pixel pitch from one tile to another to produce a seamless image.

Abstract: A display including at least two tiles which are aligned along one edge of each tile but are spaced from each other, each tile having electric field activatable pixels which produce light, each tile including and are spaced from their aligned edge, and a back plate aligned with the two tiles and having electric field activatable pixels which are disposed so that they are positioned in the space provided between the aligned tiles whereby, when pixels on the two tiles and the back plate are activated, a seamless image is produced.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.