Abstract: A semiconductor integrated circuit comprises a substrate including a plurality of transistors, and a conductive line for coupling at least two of the transistors with each other, each transistor comprising a drain diffusion region, a source diffusion region, a gate region, and a test diffusion region within the substrate, the test diffusion region being electrically coupled to a metal line within the semiconductor integrated circuit for establishing an indication of the voltage at the probing diffusion region.

Abstract: A circuit and method for testing on-chip memory for a microprocessor or a microcomputer is disclosed. The memory test circuit includes an input register, an output register, an adder, and a sequencer to control the test process. The process includes receiving a simple communication protocol from the control unit to start the test, running a common memory test such as a checker board, AAAAh, 5555h and the like, and then storing the test results in an output register. The test circuit can include a bi-directional RESET signal means for disabling the system while the microprocessor or microcomputer runs its memory test.

Abstract: A circuit and method for testing on-chip memory for a microprocessor or a microcomputer is disclosed. The memory test circuit includes an input register, an output register, an adder, and a sequencer to control the test process. The process includes receiving a simple communication protocol from the control unit to start the test, running a common memory test such as a checker board, AAAAh, 5555h and the like, and then storing the test results in an output register. The test circuit can include a bi-directional RESET signal means for disabling the system while the microprocessor or microcomputer runs its memory test.

Abstract: A circuit and method for testing on-chip memory for a microprocessor or a microcomputer is disclosed. The memory test circuit includes an input register, an output register, an adder, and a sequencer to control the test process. The process includes receiving a simple communication protocol from the control unit to start the test, running a common memory test such as a checker board, AAAAh, 5555h and the like, and then storing the test results in an output register. The test circuit can include a bi-directional RESET signal means for disabling the system while the microprocessor or microcomputer runs its memory test.

Abstract: The probability of soft-programming of the reference cells of a FLASH-EPROM memory may be excluded by having a decoupling transistor of a type of conductivity opposite to that of the cells functionally connected between the gate of each reference cell and the respective row line. Moreover the elimination of the electrical stresses to which the reference cells are subjected during the repeated programming cycles of the memory cells, increases the stability of the respective reference values of threshold and current level provided by the reference cells, thus increasing the reliability of the device.

Abstract: Each common source region of the cells of a row of a FLASH-EPROM matrix may be segmented and each segment is individually connected to a secondary source line patterned in a second level metal layer by a plurality of contacts between each common source region and patterned portions of a first level metal and through as many interconnection vias between the latter patterned portions of the first level of metal and the relative secondary source line patterned in the second metal layer. The secondary source lines are brought out of the matrix orthogonally to the bit lines and may be connected to a dedicated selection circuitry, thus permitting the erasing by groups or banks of cells of the FLASH-EPROM memory.