Abstract: A method for assembling an optical interconnect apparatus is provided. The optical interconnect comprises an integrated circuit chip, and at least one optoelectronic chip positioned on the integrated circuit chip, each of the at least one optoelectronic chip including a 2-dimensional optoelectronic array. The optical interconnect further comprises a first and a second microlens array, a bundle of optical fibers coupled to each second microlens array and supported by a bundle housing, and a block structure supporting the bundle housing to a printed circuit board (PCB).

Abstract: A fiber optic bundle including a coupler and a large matrix of fibers assembled from optical ribbons positioned very accurately in the coupler. Preferably, the coupler includes at least two plates, most preferably silicon plates, with a plurality of fiber receiving guides etched therethrough.

Abstract: A fiber optic bundle including a coupler and a large matrix of fibers assembled from optical ribbons positioned very accurately in the coupler. Preferably, the coupler includes at least two plates, most preferably silicon plates, with a plurality of fiber receiving guides etched therethrough.