Patents by Inventor Gideon Reisfeld

Gideon Reisfeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11664187
    Abstract: An apparatus comprising a beam emitter to emit a beam comprising electrons, ions or laser-light photons toward a target substrate. A motion sensor to detect mechanical vibrations of the target substrate. The motion sensor is mechanically coupled to the target substrate, a processor coupled to an output of the motion sensor. The processor is to generate a vibration correction signal proportional to the mechanical vibrations detected by the motion sensor, and beam steering optics coupled to the processor. The beam steering optics are to deflect the beam according to the vibration correction signal to compensate for the mechanical vibrations of the target substrate.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: May 30, 2023
    Assignee: Intel Corporation
    Inventors: Amir Raveh, Gideon Reisfeld, Patrick Pardy
  • Publication number: 20210305009
    Abstract: An apparatus comprising a beam emitter to emit a beam comprising electrons, ions or laser-light photons toward a target substrate. A motion sensor to detect mechanical vibrations of the target substrate. The motion sensor is mechanically coupled to the target substrate, a processor coupled to an output of the motion sensor. The processor is to generate a vibration correction signal proportional to the mechanical vibrations detected by the motion sensor, and beam steering optics coupled to the processor. The beam steering optics are to deflect the beam according to the vibration correction signal to compensate for the mechanical vibrations of the target substrate.
    Type: Application
    Filed: June 10, 2021
    Publication date: September 30, 2021
    Applicant: Intel Corporation
    Inventors: Amir Raveh, Gideon Reisfeld, Patrick Pardy
  • Patent number: 6564859
    Abstract: A heat exchanger system for mobile platforms is provided. In one embodiment, a heat conductive block is coupled with an integrated circuit package. A first proximal end of a first section of heat conductive tube is coupled to the metal block, and a free end of the first section of heat conductive tube is configured to sealably couple with a second free end of a corresponding second portion of heat conductive tube. Additionally, a first portion of a wick is disposed within the first section of heat conductive tube.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: May 20, 2003
    Assignee: Intel Corporation
    Inventor: Gideon Reisfeld
  • Publication number: 20030000681
    Abstract: A heat exchanger system for mobile platforms is provided. In one embodiment, a heat conductive block is coupled with an integrated circuit package. A first proximal end of a first section of heat conductive tube is coupled to the metal block, and a free end of the first section of heat conductive tube is configured to sealably couple with a second free end of a corresponding second portion of heat conductive tube. Additionally, a first portion of a wick is disposed within the first section of heat conductive tube.
    Type: Application
    Filed: June 27, 2001
    Publication date: January 2, 2003
    Inventor: Gideon Reisfeld