Abstract: A method of inspecting a component using an eddy current array probe (ECAP) is provided. The method includes scanning a surface of the component with the ECAP, collecting, with the ECAP, a plurality of partial defect responses, transferring the plurality of partial defect responses to a processor, modeling the plurality of partial defect responses as mathematical functions based on at least one of a configuration of elements of the ECAP and a resolution of the elements, and producing a single maximum defect response from the plurality of partial defect responses.

Abstract: A method for testing a component using an eddy current array probe is provided. The method includes calibrating the eddy current array probe, collecting data from the eddy current array probe for analysis, and processing the collected data to at least one of compensate for response variations due to a detected orientation of a detected imperfection and to facilitate minimizing noise.

Abstract: Several eddy current array probes (ECAP) with enhanced drive coil configurations are described. In one arrangement, an ECAP includes a number of EC channels and a number of drive coils. Each of the drive coils is provided for a respective one of the EC channels. The drive coils have alternating polarity with respect to neighboring drive coils. In another arrangement, an ECAP for detecting flaws in a number of scanning and orientation configurations includes at least one substrate, a number of sense coils arranged on the substrate(s), and a drive coil encompassing all of the sense coils. In another arrangement, an ECAP includes substrate, sense coils arranged in at least two rows, and at least one drive line. One drive line is provided for each pair of rows and disposed between the rows.

Abstract: A method for inspecting a component having a surface profile that includes a local minima and a local maxima. The method includes generating a raw image of a component under test utilizing an eddy current inspection system, decomposing the raw image into a plurality of images wherein each image includes a different frequency component, and reconstructing at least one final image of the component that includes frequency components that are relevant to an eddy current flaw signal.

Abstract: An eddy current inspection system and method for inspecting a component is provided. The system includes an eddy current probe for sensing eddy currents from the component and an analog to digital converter configured for converting eddy currents to digital signals. The system also includes a processor configured for generating an eddy current image from the digital signals and pre-processing the image to enhance a quality of the image. The processor is configured to identify regions displaying flaw patterns and calculating a defect characterizing parameter for the identified regions.

Abstract: Several eddy current array probes (ECAP) with enhanced drive coil configurations are described. In one arrangement, an ECAP includes a number of EC channels and a number of drive coils. Each of the drive coils is provided for a respective one of the EC channels. The drive coils have alternating polarity with respect to neighboring drive coils. In another arrangement, an ECAP for detecting flaws in a number of scanning and orientation configurations includes at least one substrate, a number of sense coils arranged on the substrate(s), and a drive coil encompassing all of the sense coils. In another arrangement, an ECAP includes substrate, sense coils arranged in at least two rows, and at least one drive line. One drive line is provided for each pair of rows and disposed between the rows.

Abstract: A method for inspecting a component having a surface profile that includes a local minima and a local maxima. The method includes positioning an eddy current probe proximate to a surface of the component to generate a first position indication, positioning the eddy current probe proximate to the surface of the component to generate a second position indication that is different than the first position indication, and interpolating between the first and second position indications to determine a profile of a portion of the surface of the component.

Abstract: A method for inspecting a component. The method includes generating a scan plan of a component to be inspected, coupling a side-mount probe to an eddy current inspection system, inducing an eddy current into the component, measuring the eddy current in the component to generate a plurality of scan data, and analyzing the scan data to generate at least one image of the component being inspected.

Abstract: An omnidirectional eddy current (EC) probe includes at least one EC channel having a first and a second sense coil that are offset in a first (x) and a second (y) direction and overlap in at least one of the directions (x,y). At least one drive coil is configured to generate a probing field for the EC channel in a vicinity of the sense coils. An omnidirectional EC inspection system includes an omnidirectional EC array probe (ECAP) that includes a number of EC channels and drive coils. Each EC channel includes first and second sense coils with opposite polarities. The drive coils have alternating polarities. Electrical connections perform differential sensing for respective EC channels. Corrective drive coils are disposed at respective ends of the EC channels and generate probing fields. An eddy current instrument is connected to the omnidirectional ECAP and receives differential sensing signals from the EC channels.