Abstract: A proximity sensor 717 comprising a combination of an arbitrarily selected one of a plurality of types of detection end modules 707, a plurality of types of output circuit modules 709 and a plurality of types of outer shell cases 711. The detection end module 707 includes an integrated arrangement having a detection coil assembly (705, 701, 702) with the detection characteristic self-completed by a mask conductor 700 for reducing the conductor detection sensitivity in a specific peripheral area where the outer shell case is assumed to exist, and a detection circuit assembly (703) with the coil of the detection coil assembly as a resonance circuit element. The characteristics of the proximity sensor are completely adjusted before shipment. As a result, the adjustment of the characteristics which otherwise might be required each time is eliminated even in the case of the combination with an outer shell case of a different material.

Abstract: A proximity sensor 717 comprising a combination of an arbitrarily selected one of a plurality of types of detection end modules 707, a plurality of types of output circuit modules 709 and a plurality of types of outer shell cases 711. The detection end module 707 includes an integrated arrangement having a detection coil assembly 705, 701, 702) with the detection characteristic self-completed by a mask conductor 700 for reducing the conductor detection sensitivity in a specific peripheral area where the outer shell case is assumed to exist, and a detection circuit assembly (703) with the coil of the detection coil assembly as a resonance circuit element. The characteristics of the proximity sensor are completely adjusted before shipment. As a result, the adjustment of the characteristics which otherwise might be required each time is eliminated even in the case of the combination with an outer shell case of a different material.

Abstract: It is intended to provide a sealing and molding resin composition capable of sealing an electric and electronic component to be sealed without degrading function and reliability thereof and providing a switch component excellent in water resistance, durability and flame resistance, and to provide a method for sealing an electronic component using the sealing resin composition; wherein the sealing and molding resin composition is a polyester sealing resin composition comprising a polyester resin (A) having a molten viscosity of 1000 dPa·s or less at 200° C., a glass transition temperature of ?10° C. or less and a melting point of 70° C. to 200° C., and antimony trioxide (B) and polydibromostyrene (C) as a flame resistant agent at a weight percentage of (A):((B)+(C))=100:20 to 30 and (B):(C)=1:1 to 4, and the method comprises the step of sealing an electronic component with the sealing resin composition.

Abstract: An electronic equipment such as a proximity sensor. A groove for discharging air is formed at coil casing (7) arranged at a front surface of the proximity sensor. An opening (43) is formed at a clamp portion (9) holding a code (10) behind a metal casing (8). The proximity sensor (1) is held at a low pressure, and resin is supplied through the opening (43) at the clamp portion (9), whereby the casing can be filled with the resin in a short time.

Abstract: An electronic equipment such as a proximity sensor. A groove for discharging air is formed at coil casing (7) arranged at a front surface of the proximity sensor. An opening (43) is formed at a clamp portion (9) holding a code (10) behind a metal casing (8). The proximity sensor (1) is held at a low pressure, and resin is supplied through the opening (43) at the clamp portion (9), whereby the casing can be filled with the resin in a short time.