Abstract: Aspects of the present disclosure relate to a transfer device, system, and method for transferring an electronic component onto a placement position on a substrate. The transfer device is based on a fluidic process principle in which electronic components are transferred in a transfer liquid. In accordance with an aspect of the present disclosure, the transfer device further includes a plurality of acoustic transducers, and a controller for controlling the plurality of acoustic transducers. The controller is configured to control the plurality of acoustic transducers to create an acoustic trap in the transfer liquid for capturing an electronic component when it is released in the transfer liquid and to subsequently manipulate the position and/orientation of the acoustic trap for the purpose of positioning the electronic component at the placement position on the substrate.

Abstract: Aspects of the present disclosure relate to a system for transporting an electronic component. Further aspects of the present disclosure relate to a method for transporting an electronic component. According to an aspect of the present disclosure a system for transporting an electronic component is provided that includes a carrier for carrying the electronic component, and a transducer system including a plurality of transducers, the transducer system being configured for generating a levitation field in which the carrier levitates. The system also includes an input unit for arranging the electronic component onto the carrier, and an output unit for receiving the electronic component from the carrier. A controller is used for controlling the transducer system to change the levitation field for the purpose of moving the carrier from the input unit to the output unit.

Abstract: The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.

Abstract: An apparatus for transferring a semiconductor die from an arrangement dies to a target is provided and relates to a wafer stage, and film frame carrier, and to an assembly including the film frame carrier and arrangement of dies. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged. The wafer stage includes a motor for rotating the curved shell around a rotational axis. The configuration allows improved throughput of the wafer stage. The carrier used with this wafer stage includes a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the mounting surface becomes more convex than the first shape.