Abstract: Aspects of the invention relate to a semiconductor chip comprising a substrate and a stack arranged on the substrate. The stack comprises one or more insulating layers and one or more metal layers. The chip comprises a sensor device arranged in a sensor area (SA) of the semiconductor chip and processing circuitry arranged in a processing area (PA) of the semiconductor chip. The chip further comprises connection circuitry configured to provide an electrical connection between the sensor device and the processing circuitry. A first seal ring structure is arranged between an outer edge (ED) of the chip and an inner area (IA) of the chip. The inner area (IA) of the chip encompasses the sensor area (SA) and the processing area (PA). A second seal ring structure is arranged between the sensor area (SA) and the processing area (PA) and configured to constrain an infiltration of contaminants from the sensor area (SA) to the processing area (PA).

Abstract: The method uses an integrated circuit comprising a processor (603), a non-volatile memory (602), especially a flash memory, a system clock and an interface (605), which is connected on the one side to the processor (602) and on the other side to the non-volatile memory (602). When the address (ba[ ]) provided by the processor (603) has changed, the interface (605) leads the address (ba[ ]) to the non-volatile memory (602), creates a strobe signal (CL; DCR) within the system clock cycle during which the address (ba[ ]) has changed and directs it to the non-volatile memory (602). As soon as the data in the non-volatile memory (602) corresponding to the address (ba[ ]) are available the data will be directed to the processor (603). Thereby it is possible to get on the integrated circuit the highest data throughput according to the flash memory (602) access time and a minimized chip area at the same time.

Abstract: The integrated circuit according to the invention comprises a processor (603), a non-volatile memory (602) and an interface (605), where said interface (605) contains a first cache memory (601.1) and a second cache memory (601.2) and connects the processor (603) to the non-volatile memory (602). The interface (605) gets data from the non-volatile memory (602) and stores them in said first or said second cache memory (601.1, 601.2) intermediately and provides the processor (603) with data from said first cache memory (601.1) or from said second cache memory (601.2), depending on where the requested data are stored.

Abstract: The integrated circuit according to the invention comprises a processor (603), a non-volatile memory (602) and an interface (605), where said interface (605) contains a first cache memory (601.1) and a second cache memory (601.2) and connects the processor (603) to the non-volatile memory (602). The interface (605) gets data from the non-volatile memory (602) and stores them in said first or said second cache memory (601.1, 601.2) intermediately and provides the processor (603) with data from said first cache memory (601.1) or from said second cache memory (601.2), depending on where the requested data are stored.

Abstract: The method uses an integrated circuit comprising a processor (603), a non-volatile memory (602), especially a flash memory, a system clock and an interface (605), which is connected on the one side to the (processor (602) and on the other side to the non-volatile memory (602). When the address (ba[ ]) provided by the processor (603) has changed, the interface (605) leads the address (ba[ ]) to the non-volatile memory (602), creates a strobe signal (CL; DCR) within the system clock cycle during which the address (ba[ ]) has changed and directs it to the non-volatile memory (602). As soon as the data in the non-volatile memory (602) corresponding to the address (ba[ ]) are available the data will be directed to the processor (603). Thereby it is possible to get on the integrated circuit the highest data throughput according to the flash memory (602) access time and a minimized chip area at the same time.