Abstract: A semiconductor device which comprises an insulating flexible substrate having conductors extending on one side of the foil from the edge to near the center. A semiconductor element is connected with its contacts connected to the ends of the conductors at the center of the foil. On the side of the foil remote from the conductors a reinforcement member is provided which is present at least near the edges of the foil, the reinforcement member being connected in an adhering manner to the foil and having a pre-shaped contour so as to bend the foil in such manner that the surface of the semiconductor element remote from the foil and the ends of the conductors situated near the edges of the foil are situated substantially in the same plane.

Abstract: A hybrid circuit comprises an insulating substrate which is provided with conductors and on which a semiconductor circuit is provided consisting of a semiconductor element connected to an insulating flexible foil having conductor tracks, and in which the side of the semiconductor element remote from the foil bears on spacers of the substrate. Connection material fills entirely the space between the semiconductor element and the substrate, while near connection sites of the foil to the substrate elongated spacers on which side edges of the foil bear are provided on the substrate between conductors, and the space between the elongate spacers is filled with connection material which connects the ends of the conductor tracks to the conductors of the substrate.