Patents by Inventor Gil-Beag Kim
Gil-Beag Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130342236Abstract: A test interface board comprises at least one switch matrix including a plurality of switching elements that connect a plurality of connection nodes to each other. The at least one switch matrix is configured to connect a plurality of channels of an automatic test equipment (ATE) to respective pin positions corresponding to a device under test (DUT) in response to switching control signals. The plurality of channels provide test operation signals for testing the DUT. A control logic is configured to generate the switching control signals based on pin configuration information of the DUT.Type: ApplicationFiled: March 14, 2013Publication date: December 26, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ki-Jae Song, Jong-Woon Yoo, Sang-Kyeong Han, Gil-Beag Kim
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Publication number: 20090017583Abstract: A double encapsulated semiconductor package and manufacturing methods of forming the same are provided. Embodiments of the semiconductor package include a complex chip having normal and random pads formed on its active surface, the complex chip being attached to a first surface of a wiring substrate. First and second windows are formed in the wiring substrate to respectively expose the normal and random pads, and to allow bonding wires to be connected to the normal and random pads with the wiring substrate. A first resin encapsulation portion is formed by a molding method in the first window and a second resin encapsulation portion is formed by a potting method in the second window.Type: ApplicationFiled: September 24, 2008Publication date: January 15, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byung-Seok JUN, Gil-Beag KIM, Yong-Jin LEE
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Patent number: 7405105Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.Type: GrantFiled: September 28, 2007Date of Patent: July 29, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang
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Publication number: 20080136027Abstract: Provided is a method of bonding a wire of a semiconductor package, by which a loop height may be reduced and/or a bonding reliability may be enhanced. In the method, a ball bump may be formed on a bonding pad on a semiconductor chip using a capillary through which a wire may be supplied. The wire may then be cut from the ball bump using the capillary. Subsequently, the capillary may be moved to an interconnection corresponding to the bonding pad of the semiconductor chip to perform stitch bonding of the wire supplied through the capillary on the interconnection. The capillary may again be moved to the ball bump formed on the bonding pad to bond the wire on the ball bump.Type: ApplicationFiled: November 2, 2007Publication date: June 12, 2008Inventors: Tae-ho Moon, Sang-young Kim, Gil-beag Kim, Yong-jin Jung
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Publication number: 20080049402Abstract: A printed circuit board having supporting patterns is provided. The printed circuit board includes a base substrate having a circuit region and peripheral regions. The circuit region includes a plurality of unit cells arranged in a matrix, and the peripheral regions are located around the circuit region. Wires are located on the circuit region. First supporting bars are located on the peripheral regions and extend across the peripheral regions, and a plurality of supporting ribs traverse the first supporting bars.Type: ApplicationFiled: July 9, 2007Publication date: February 28, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jun-Soo HAN, Gil-Beag KIM, Yong-Jin JUNG
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Publication number: 20080026507Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.Type: ApplicationFiled: September 28, 2007Publication date: January 31, 2008Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang
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Patent number: 7291925Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.Type: GrantFiled: May 20, 2005Date of Patent: November 6, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang
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Patent number: 7288436Abstract: A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.Type: GrantFiled: December 6, 2004Date of Patent: October 30, 2007Assignee: Samsung Electronics, Co., Ltd.Inventors: Sang-Young Kim, Gil-Beag Kim, Yong-Jin Jung, Jun-Soo Han, Hyun-Ik Hwang
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Publication number: 20070164407Abstract: A double encapsulated semiconductor package and manufacturing methods of forming the same are provided. Embodiments of the semiconductor package include a complex chip having normal and random pads formed on its active surface, the complex chip being attached to a first surface of a wiring substrate. First and second windows are formed in the wiring substrate to respectively expose the normal and random pads, and to allow bonding wires to be connected to the normal and random pads with the wiring substrate. A first resin encapsulation portion is formed by a molding method in the first window and a second resin encapsulation portion is formed by a potting method in the second window.Type: ApplicationFiled: August 14, 2006Publication date: July 19, 2007Applicant: Samsung Electronics Co., Ltd.Inventors: Byung-Seok Jun, Gil-Beag Kim, Yong-Jin Lee
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Publication number: 20060118831Abstract: A semiconductor package may include a substrate having a first major surface supporting a substrate pad and a bump pad electrically connected to the substrate pad. The substrate may have a second major surface with a concave part. A substrate window may extend through the substrate and open at the concave part. A semiconductor chip may be mounted on the substrate. The semiconductor chip may have a chip pad exposed through the substrate windows. Additionally, a method may involve forming a concave part in the substrate.Type: ApplicationFiled: November 8, 2005Publication date: June 8, 2006Inventors: Hyun-Ik Hwang, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Jun-Soo Han
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Publication number: 20060102996Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.Type: ApplicationFiled: May 20, 2005Publication date: May 18, 2006Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang
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Publication number: 20050287708Abstract: A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.Type: ApplicationFiled: December 6, 2004Publication date: December 29, 2005Inventors: Sang-Young Kim, Gil-Beag Kim, Yong-Jin Jung, Jun-Soo Han