Abstract: In one embodiment, a memory is provided that includes: a plurality of memory cells arranged in columns, each column coupled to a corresponding bit line; a sense amplifier adapted to sense the voltage on a pair of the bit lines to determine a binary state of an accessed memory cell coupled to a first one of the bit lines in the pair; and a first trim capacitor having a first terminal directly coupled to one of the bit lines in the pair, the first trim capacitor having an opposing second terminal coupled to a first trim capacitor signal, the memory being adapted to change a voltage of the first trim capacitor signal while the sense amplifier senses the voltage to determine the binary state of the accessed memory cell.

Abstract: In one embodiment, a dynamic random access memory (DRAM) is provided that includes: a substrate including a plurality of access transistors, and a plurality of storage capacitors corresponding uniquely to the plurality of access transistors, each storage capacitor being formed in a plurality of semiconductor manufacturing process metal layers adjacent the substrate.

Abstract: In one embodiment, a memory is provided that includes: a plurality of memory cells arranged in columns, each column coupled to a corresponding bit line; a sense amplifier adapted to sense the voltage on a pair of the bit lines to determine a binary state of an accessed memory cell coupled to a first one of the bit lines in the pair; and a first trim capacitor having a first terminal directly coupled to one of the bit lines in the pair, the first trim capacitor having an opposing second terminal coupled to a first trim capacitor signal, the memory being adapted to change a voltage of the first trim capacitor signal while the sense amplifier senses the voltage to determine the binary state of the accessed memory cell.