Abstract: The present invention is an apparatus and process for storing and delivering a low vapor pressure process chemical to a process tool for semiconductor fabrication, comprising: a) a bulk container for storing the process chemical; b) a process container for delivering the process chemical to the process tool; c) a first manifold for delivering process chemical from the bulk container to the process container; d) a solvent container containing a quantity of solvent, e) a second manifold for delivering the process chemical from the process container to a process tool; f) a solvent recovery container for containing used solvent and removed process chemical, and, g) a solvent evaporator to differentially remove solvent from process chemical in the solvent recovery container by entrainment in a carrier gas, vacuum removal, heating or combinations thereof. The containers can be baffled on their inert gas inlets. The cabinet can be heated.

Abstract: The present invention is an apparatus and process for storing and delivering a low vapor pressure process chemical to a process tool for semiconductor fabrication, comprising: a) a bulk container for storing the process chemical; b) a process container for delivering the process chemical to the process tool; c) a first manifold for delivering process chemical from the bulk container to the process container; d) a solvent container containing a quantity of solvent, e) a second manifold for delivering the process chemical from the process container to a process tool; f) a solvent recovery container for containing used solvent and removed process chemical, and, g) a solvent evaporator to differentially remove solvent from process chemical in the solvent recovery container by entrainment in a carrier gas, vacuum removal, heating or combinations thereof. The containers can be baffled on their inert gas inlets. The cabinet can be heated.

Abstract: The present invention is an apparatus for storing and delivering a low vapor pressure process chemical to a process tool for semiconductor fabrication, comprising: a) a bulk container for storing the process chemical; b) a process container for delivering the process chemical to the process tool; c) a first manifold for delivering process chemical from the bulk container to the process container; d) a solvent container containing a quantity of solvent, and; e) a second manifold for delivering the process chemical from the process container to a process tool. A process for using the apparatus is also contemplated.

Abstract: A manifold comprising a container having two ports; a conduit connecting the container to a source/dispense of chemical having a first end and a second end and a connector for the ends; first block valve having two diaphragm valves, each valve having a valve seat side and a diaphragm side, each valve seat side faces the other valve seat side, and connected to the first end of the conduit, one diaphragm side connected to a first port, and another diaphragm side connected to vent; a second block valve having two diaphragm valves, having a valve seat side and a diaphragm side, wherein each valve seat side faces the other valve seat side, and each valve seat side connected to the second end of the conduit, the diaphragm side of one valve connected to purge, and the diaphragm side of another valve connected to push gas or chemical outlet.

Abstract: The present invention is an apparatus for storing and delivering a low vapor pressure process chemical to a process tool for semiconductor fabrication, comprising: a) a bulk container for storing the process chemical; b) a process container for delivering the process chemical to the process tool; c) a first manifold for delivering process chemical from the bulk container to the process container; d) a solvent container containing a quantity of solvent, and; e) a second manifold for delivering the process chemical from the process container to a process tool. A process for using the apparatus is also contemplated.

Abstract: A manifold for transfer of chemical, comprising; a heated first conduit for connecting a vessel for containing the chemical to a another vessel, a source of pressurized gas and a source of vacuum; a heated first block valve assembly having first and second diaphragm valves, each valve having a diaphragm and a valve seat side and a diaphragm side, wherein the valve seat side of each valve is juxtaposed to the valve seat side of the other valve, and each valve seat side of each valve communicating with the first conduit; a first connector in the first conduit for detaching the conduit from the vessel; a second conduit, for delivering chemical to the vessel, the second conduit connected to the diaphragm side of the first valve; and a third conduit, for communicating pressurized gas and vacuum to the first conduit, connected to the diaphragm side of the second valve.