Abstract: The present invention relates to a dental care device for detection and removal of plaque automatically and independently, comprising: a) a motion controlled and pressure sensitive plaque removal head having at least one array of bristles; b) a plaque detection unit adapted to capture images of the teeth and gums, wherein said plaque detection unit includes an imaging device and a light source with specific wavelength for illumination said teeth and gums; and c) a plaque detection engine adapted to process the captured images in order to detect plaque infected areas on said teeth, and accordingly to generate instructions for automatically guiding said motion controlled plaque removal head, thereby executing all the necessary movements for automatically and independently removing the plaque from said teeth while minimizing abrasiveness by controlling the pressure applied and avoiding brushing to clean areas of the teeth and gums.

Abstract: The present invention relates to a dental care device for detection and removal of plaque automatically and independently, comprising: a) a motion controlled and pressure sensitive plaque removal head having at least one array of bristles; b) a plaque detection unit adapted to capture images of the teeth and gums, wherein said plaque detection unit includes an imaging device and a light source with specific wavelength for illumination said teeth and gums; and c) a plaque detection engine adapted to process the captured images in order to detect plaque infected areas on said teeth, and accordingly to generate instructions for automatically guiding said motion controlled plaque removal head, thereby executing all the necessary movements for automatically and independently removing the plaque from said teeth while minimizing abrasiveness by controlling the pressure applied and avoiding brushing to clean areas of the teeth and gums.

Abstract: Test samples for use in conducting integrated circuit alpha particle emissions testing, processes for preparing test samples for use in conducting integrated circuit alpha particle emissions testing, and processes for conducting integrated circuit alpha particle emissions testing using the test samples, are described. The approach takes into account the effects of the relative physical positions of the respective components within a final integrated circuit package, and takes into account the effect of contamination of individual components or of the integrated circuit package as a whole due to conditions and/or processes performed during the production process. The described approach relates to test sample preparation and integrated circuit alpha particle emissions testing for integrated circuits in which the alpha particle emission levels are extremely low, i.e., in the ultra low alpha region, for example, alpha particle emissions less than 0.002 cph/cm2.

Abstract: Test samples for use in conducting integrated circuit alpha particle emissions testing, processes for preparing test samples for use in conducting integrated circuit alpha particle emissions testing, and processes for conducting integrated circuit alpha particle emissions testing using the test samples, are described. The approach takes into account the effects of the relative physical positions of the respective components within a final integrated circuit package, and takes into account the effect of contamination of individual components or of the integrated circuit package as a whole due to conditions and/or processes performed during the production process. The described approach relates to test sample preparation and integrated circuit alpha particle emissions testing for integrated circuits in which the alpha particle emission levels are extremely low, i.e., in the ultra low alpha region, for example, alpha particle emissions less than 0.002 cph/cm2.