Abstract: There is provided a system and method of examining a specimen comprising a first layer and a second layer. The method comprises obtaining a recipe including a template image for each reference polygon in a reference image and a template mask indicative of proximity of a set of locations in the template image to an edge of the reference polygon; obtaining an inspection image in runtime; identifying first inspection polygons in the inspection image corresponding to the first reference polygons using template images and template masks thereof; determining a first shift for the first layer based on the first locations, and registering the first reference polygons with the inspection image based on the first shift. Similarly, a second shift for the second layer can be determined, and the second reference polygons can be registered with the inspection image based on the second shift.

Abstract: A system for examining a semiconductor specimen that includes a plurality of layers at respective different depths, and a plurality of holes. Each hole has a top portion at the surface of the specimen, and a bottom portion accommodated in one of the layers. The system includes a processing and memory circuitry (PMC) configured to provide an inspection image indicative of the holes, and process a hole image in the inspection image, without using a shape characterizing model. The processing includes segmenting the inspection image and determining data indicative of a contour of the top portion of the hole, and further segmenting the inspection image and determining data indicative of a contour of a shape enclosed within the contour of the top of the hole.

Abstract: There is provided a system and method of examining a specimen comprising a first layer and a second layer. The method comprises obtaining a recipe including a template image for each reference polygon in a reference image and a template mask indicative of proximity of a set of locations in the template image to an edge of the reference polygon; obtaining an inspection image in runtime; identifying first inspection polygons in the inspection image corresponding to the first reference polygons using template images and template masks thereof; determining a first shift for the first layer based on the first locations, and registering the first reference polygons with the inspection image based on the first shift. Similarly, a second shift for the second layer can be determined, and the second reference polygons can be registered with the inspection image based on the second shift.