Patents by Inventor Gilbert Assaud

Gilbert Assaud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tear-proof circuit
    Patent number: 9226393
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: December 29, 2015
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Gilbert Assaud
  • Perforated electronic package and method of fabrication
    Patent number: 9196590
    Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: November 24, 2015
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Delphine Mathey, Gilbert Assaud, Rémi Brechignac
  • PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
    Publication number: 20150262941
    Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 17, 2015
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Delphine Mathey, Gilbert Assaud, Rémi Brechignac
  • TEAR-PROOF CIRCUIT
    Publication number: 20150029275
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Application
    Filed: October 10, 2014
    Publication date: January 29, 2015
    Inventors: Francis Steffen, Gilbert Assaud
  • Tear-proof circuit
    Patent number: 8867217
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 21, 2014
    Assignee: STMicroelectronics Rousset SAS
    Inventors: Francis Steffen, Gilbert Assaud
  • TEAR-PROOF CIRCUIT
    Publication number: 20100194645
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Application
    Filed: January 29, 2010
    Publication date: August 5, 2010
    Applicant: STMICROELECTRONICS ROUSSET SAS
    Inventors: Francis Steffen, Gilbert Assaud