Abstract: A method of polishing at least one surface of a silicon-based part made of SiO2, of SiC, of glass, of vitro-ceramic, or of quartz, the method comprising: a) a pre-polishing stage implementing at least one pre-polishing element and an abrasive, to confer a first roughness to said surface; b) a polishing stage implementing at least one polishing element and a liquid containing a polishing abrasive to confer to said surface a second roughness that is smaller than the first roughness; the method comprising: c) a finishing stage by soft abrasion implementing at least one finishing element, in particular a felt, and a soft abrasive, to remove a surface layer of sufficient thickness to improve the flux strength of the part.

Abstract: The invention relates to a machine for cooling metal wire. This machine comprises a cooling tube, an injection device for the cooling fluid and a bypass device for the cooling fluid. The injection device comprises an oblique annular slot fed under high pressure and injectors fed under low pressure. The bypass device comprises an open elbow extending the tube and a second elbow of an opposite curvature terminating in a direction normal in relation to that of the wire. The invention is applied to the cooling of a metal wire, with or without hardening.