Patents by Inventor Gilbert Hendry
Gilbert Hendry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240078422Abstract: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.Type: ApplicationFiled: June 29, 2023Publication date: March 7, 2024Inventors: Huaiyu Meng, Yichen Shen, Yelong Xu, Gilbert Hendry, Longwu Ou, Jingdong Deng, Ronald Gagnon, Cheng-Kuan Lu, Maurice Steinman, Mike Evans, Jianhua Wu
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Publication number: 20240077755Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.Type: ApplicationFiled: April 27, 2023Publication date: March 7, 2024Inventors: Huaiyu Meng, Cheng-Kuan Lu, Jonathan Terry, Jingdong Deng, Maurice Steinman, Gilbert Hendry, Yichen Shen
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Patent number: 11734556Abstract: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.Type: GrantFiled: March 17, 2021Date of Patent: August 22, 2023Assignee: Lightelligence PTE. Ltd.Inventors: Huaiyu Meng, Yichen Shen, Yelong Xu, Gilbert Hendry, Longwu Ou, Jingdong Deng, Ronald Gagnon, Cheng-Kuan Lu, Maurice Steinman, Mike Evans, Jianhua Wu
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Patent number: 11719963Abstract: An apparatus having a segmented optical modulator includes an optical waveguide having three or more segments. Each of three or more optical modulators includes a corresponding waveguide segment and is configured to apply an optical modulation that is proportional to the length of the segment. Three or more electrical contacts receive respective bit values of binary values. Each binary value includes at least three bit values including a least significant bit (LSB) bit value, a most significant bit (MSB) bit value, and at least one intermediate bit (IB) bit value between the LSB bit value and the MSB bit value. At least one waveguide segment of a corresponding optical modulator receiving an LSB bit value is positioned between a first waveguide segment of a corresponding optical modulator receiving an MSB bit value and a second waveguide segment of a corresponding optical modulator receiving an IB bit value.Type: GrantFiled: April 28, 2021Date of Patent: August 8, 2023Assignee: Lightelligence, Inc.Inventors: Cheng-Kuan Lu, Gilbert Hendry, Huaiyu Meng, Yichen Shen
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Patent number: 11686955Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.Type: GrantFiled: July 6, 2021Date of Patent: June 27, 2023Assignee: Lightelligence, Inc.Inventors: Huaiyu Meng, Cheng-Kuan Lu, Jonathan Terry, Jingdong Deng, Maurice Steinman, Gilbert Hendry, Yichen Shen
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Publication number: 20220004029Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.Type: ApplicationFiled: July 6, 2021Publication date: January 6, 2022Inventors: Huaiyu Meng, Cheng-Kuan Lu, Jonathan Terry, Jingdong Deng, Maurice Steinman, Gilbert Hendry, Yichen Shen
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Publication number: 20210341765Abstract: An apparatus having a segmented optical modulator includes an optical waveguide having three or more segments. Each of three or more optical modulators includes a corresponding waveguide segment and is configured to apply an optical modulation that is proportional to the length of the segment. Three or more electrical contacts receive respective bit values of binary values. Each binary value includes at least three bit values including a least significant bit (LSB) bit value, a most significant bit (MSB) bit value, and at least one intermediate bit (IB) bit value between the LSB bit value and the MSB bit value. At least one waveguide segment of a corresponding optical modulator receiving an LSB bit value is positioned between a first waveguide segment of a corresponding optical modulator receiving an MSB bit value and a second waveguide segment of a corresponding optical modulator receiving an IB bit value.Type: ApplicationFiled: April 28, 2021Publication date: November 4, 2021Inventors: Cheng-Kuan Lu, Gilbert Hendry, Huaiyu Meng, Yichen Shen
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Publication number: 20210201126Abstract: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.Type: ApplicationFiled: March 17, 2021Publication date: July 1, 2021Inventors: Huaiyu Meng, Yelong Xu, Gilbert Hendry, Longwu Ou, Jingdong Deng, Ronald Gagnon, Cheng-Kuan Lu, Maurice Steinman, Mike Evans, Jianhua Wu, Yichen Shen