Abstract: A cast core process is used to fabricate a very small, precision wound helical antenna having readily repeatable configuration parameters for use in a high GHz multi-element (e.g., phased array) antenna. A dielectric core member is formed by shaping a solid mandrel having a precision helical groove. After a mold is formed around the mandrel and cured, the mandrel is extracted, so that it may be used to make additional identical molds. A dielectric mixture is injected into the mold's cavity, and cured. The mold is then removed, and antenna wire is tightly wound and bonded into the dielectric core's helical groove. The antenna wire-wrapped core is then mechanically and electrically attached to a baseplate laminate structure, that includes a tuning circuit, so that the antenna may be physically mounted to a support member and connected to an associated transmit—receive module.

Abstract: A miniaturized cylindrical `channeline` delay line comprises a plurality of concentrically stacked cylindrical elements, surfaces of which are configured to form helically contoured `channeline` transmission line. The nested stack includes a first, generally cylindrical conductive spool body element, for example a lightweight and electrically conductive cylinder or spool, having a longitudinal axis and an outer, generally cylindrical surface in which a helical groove is formed. Concentrically surrounding this interior spool are one or more additional, generally cylindrical hollow electrically conductive hollow cylinders of successively increasing diameters. These additional electrically conductive hollow cylinders are sized, so that respective ones of the cylinders may be concentrically stacked about the longitudinal axis of the interior spool. Like the interior spool, each surrounding cylinder has a helical groove formed in its outer cylindrical surface.

Abstract: A chip carrier assembly and support arrangement provides a thermally and conductively secure chip interface, and enables rapid insertion and removal of the carrier so that replacement or repair of MMIC components may be facilitated. The chip carrier, which contains one or more chip cavities, is cylindrically configured and made of a material that has a coefficient of thermal expansion that is relatively low compared to that of its surrounding housing, so that a substantially uniform radial compressive force, resulting from the difference in coefficients of thermal expansion of the housing and the carrier, acts uniformly between the cylindrical sidewall of the cylindrical slot in the housing and the cylindrical sidewall of the carrier, thereby securing the chip carrier to the housing and providing thermal and electrical continuity between the carrier and its support housing.