Abstract: A reduced or low-profile mechanical clip is described. This mechanical clip may include a trench that constrains the mechanical degrees of freedom of wires, such as those between an interface circuit and an antenna in an electronic device. Moreover, the mechanical clip may have a low height (such as less than 3 mm) so it can fit in a confined space between components in the interior of the electronic device. The mechanical clip may be mountable on a surface in the interior of the electronic device, such as on a printed circuit board or on an inner surface of a chassis or external housing of the electronic device.

Abstract: The disclosed apparatus may include (1) at least one receptacle that (A) is coupled to a line card that facilitates communication among computing devices and (B) mates with at least one member coupled to a backplane of a telecommunications system to physically support the line card upon installation in the telecommunications system and (2) at least one spring that (A) is coupled to the receptacle and (B) applies, when the member is inserted into the receptacle, a force on the member to lift the line card in an upward direction. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A reduced or low-profile mechanical clip is described. This mechanical clip may include a trench that constrains the mechanical degrees of freedom of wires, such as those between an interface circuit and an antenna in an electronic device. Moreover, the mechanical clip may have a low height (such as less than 3 mm) so it can fit in a confined space between components in the interior of the electronic device. The mechanical clip may be mountable on a surface in the interior of the electronic device, such as on a printed circuit board or on an inner surface of a chassis or external housing of the electronic device. By mechanically constraining the mechanical degrees of freedom of the wires, the mechanical clip may reduce electrical noise induced by motion of the wires. In addition, the mechanical clip may facilitate low-cost reproducible assembly of the electronic device.

Abstract: Joints for thermoplastic pipe. The necessity of providing a sealing ring between the socket and spigot of such a joint results in forming a ring groove in the socket and affixing the sealing ring within this ring groove. The present invention contemplates forming a sealing ring groove 6 so configured around a sealing ring 11 with a substantially axially incompressible portion 12 to lock the sealing ring in place and also to enhance the ease of assembly and ability of the thus assembled joint to structurally withstand elevated hydrostatic pressures. Also disclosed is an apparatus 20 and 44 for forming the preferred socket configuration.