Abstract: In a semiconductor liquid application apparatus, a calibration tool enables the rapid and accurate adjustment of height and center of a liquid dispense nozzle. In an example embodiment, the tool comprises a circular disk in which a first beveled out area corresponding to the shape of the liquid dispense nozzle is defined on the topside of the disk. Underneath the disk, a second beveled out area corresponding to the shape of the wafer chuck is defined therein. The calibration depth is determined by the thickness of the tool's substrate less the sum of the depth of the first beveled out area and the depth of the second beveled out area. This calibration depth is determined by the configuration of the nozzle used in a liquid-dispense spinner. In using the calibration tool, the nozzle height and center becomes more repeatable from operator-to-operator and machine-to-machine.

Abstract: In a semiconductor liquid application apparatus, a calibration tool enables the rapid and accurate adjustment of height and center of a liquid dispense nozzle. In an example embodiment, the tool comprises a circular disk in which a first beveled out area corresponding to the shape of the liquid dispense nozzle is defined on the topside of the disk. Underneath the disk, a second beveled out area corresponding to the shape of the wafer chuck is defined therein. The calibration depth is determined by the thickness of the tool's substrate less the sum of the depth of the first beveled out area and the depth of the second beveled out area. This calibration depth is determined by the configuration of the nozzle used in a liquid-dispense spinner. In using the calibration tool, the nozzle height and center becomes more repeatable from operator-to-operator and machine-to-machine.