Patents by Inventor Giles Monnot

Giles Monnot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having two ground pads connected to a ground connection lead and method for testing the same
    Patent number: 6100710
    Abstract: A semiconductor device includes first through fourth pads and first through third external connection leads, with the first external connection lead being a ground connection lead and the first and second pads being ground pads. First through fourth connection wires selectively connect the pads to the external connection leads. Additionally, a first ground line is connected to the first pad, a second ground line is connected to the second pad, a first protective diode connects the first ground line to the third pad, and a second protective diode connects the second ground line to the fourth pad. The first external connection lead is connected to the first pad via the first connection wire and to the second pad via the second connection wire, the third connection wire connects the third pad to the second external connection lead, and the fourth connection wire connects the fourth pad to the third external connection lead.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: August 8, 2000
    Assignee: STMicroelectronics S.A.
    Inventor: Giles Monnot
  • Semiconductor device having two ground pads connected to a ground connection lead and method for testing the same
    Patent number: 5986345
    Abstract: A semiconductor device includes first through fourth pads and first through third external connection leads with the first external connection lead being a ground connection lead and the first and second pads being ground pads. First through fourth connection wires selectively connect the pads to the external connection leads. Additionally, a first ground line is connected to the first pad, a second ground line is connected to the second pad, a first protective diode connects the first ground line to the third pad, and a second protective diode connects the second ground line to the fourth pad. The first external connection lead is connected to the first pad via the first connection wire and to the second pad via the second connection wire, the third connection wire connects the third pad to the second external connection lead, and the fourth connection wire connects the fourth pad to the third external connection lead.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: November 16, 1999
    Assignee: STMicroelectronics S. A.
    Inventor: Giles Monnot