Abstract: The invention relates to an integrated device (PM) for characterising electric or electronic components (DUT), in particular nanometric ones, comprising a substantially insulating substrate (S) on which are provided four conducting pads (P1, P2, P3, P4), at least three resistive pads (R1, R3, R4) connecting said pads together, and a transmission line (CPW) including a signal conductor (Cc) and at least one ground conductor (CL1, CL2), wherein: said resistive pads are arranged so as to connect a first conducting pad to a second and a fourth conducting pad, and to connect said fourth conducting pad to a third conducting pad; the signal conductor of the transmission line is connected to the first conducting pad; and the ground conductor of the transmission line is connected to the third pad.