Abstract: A triaxial force sensor including: a deformable membrane; a detector detecting a deformation of the membrane configured to carry out a triaxial detection of the force to be detected; and an adhesion mechanism disposed at least at one of the principal faces of the deformable membrane, configured to secure the one of the principal faces of the deformable membrane to at least one elastomer material to be acted upon by the force to be detected, and distributed uniformly at a whole of the surface of the one of the principal faces of the deformable membrane, the deformable membrane being disposed between a cavity and the elastomer material.

Abstract: A pressure sensor micromachined by using microelectronics technologies includes a cavity hermetically sealed on one side by a silicon substrate and on the other side by a diaphragm that is configured to be formed under the effect of the pressure outside the cavity. The sensor includes at least one resistance strain gage fastened to the diaphragm and has resistance that varies as a function of the deformation of the diaphragm. The diaphragm is fastened to the resistance strain gages. The gages are located inside the sealed cavity. The diaphragm has an insulting layer deposited on a sacrificial layer and may cover integrated measurement circuits in the silicon substrate.

Abstract: A process for closure of at least one cavity intended to encapsulate or be part of a microelectronic device, comprising the following steps: a) Producing a cavity in a first substrate comprising a first layer traversed by an opening forming an access to the cavity; b) Producing a portion of bond material around the opening, on a surface of the first layer located on the side opposite the cavity; c) Producing, on a second substrate, a portion of fusible material, with a deposition of the fusible material on the second substrate and the use of a mask; d) Placing the portion of fusible material in contact with the portion of bond material; e) Forming a plug for the opening, which adheres to the portion of bond material, by melting and then solidification of the fusible material; f) Separating the plug and the second substrate.

Abstract: A triaxial force sensor including: a deformable membrane; a detector detecting a deformation of the membrane configured to carry out a triaxial detection of the force to be detected; and an adhesion mechanism disposed at least at one of the principal faces of the deformable membrane, configured to secure the one of the principal faces of the deformable membrane to at least one elastomer material to be acted upon by the force to be detected, and distributed uniformly at a whole of the surface of the one of the principal faces of the deformable membrane, the deformable membrane being disposed between a cavity and the elastomer material.

Abstract: A process for closure of at least one cavity intended to encapsulate or be part of a microelectronic device, comprising the following steps: a) Producing a cavity in a first substrate comprising a first layer traversed by an opening forming an access to the cavity; b) Producing a portion of bond material around the opening, on a surface of the first layer located on the side opposite the cavity; c) Producing, on a second substrate, a portion of fusible material, with a deposition of the fusible material on the second substrate and the use of a mask; d) Placing the portion of fusible material in contact with the portion of bond material; e) Forming a plug for the opening, which adheres to the portion of bond material, by melting and then solidification of the fusible material; f) Separating the plug and the second substrate.

Abstract: The microsystems are integrated in a first cavity bounded by at least a substrate and by a top wall formed by at least a part of a first cover. The component has a second cavity bounded by at least the whole of the top wall of the first cavity and by a second cover formed by a thin layer. The second cover can be covered by a coating made of plastic material molded from a casting. The fabrication process of the component comprises deposition, on the whole of the top wall of the first cavity, of a layer of polymer material and annealing of the layer of polymer material. The layer of polymer material acts as sacrificial layer for deposition of the thin layer designed to form the second cover.

Abstract: The invention relates to pressure sensors that are micromachined using microelectronics technologies. The sensor provided by the invention comprises a cavity (V) hermetically sealed on one side by a silicon substrate (40) and on the other side by a diaphragm (58) that can be formed under the effect of the pressure outside the cavity, the sensor having at least one resistance strain gage (54, 56) fastened to the diaphragm and having resistance that varies as a function of the deformation of the diaphragm. The diaphragm, preferably made of silicon nitride, is fastened to the resistance strain gages. The gages are located beneath the diaphragm inside the sealed cavity (V). It is not necessary to recess the substrate to produce the cavity: the diaphragm is formed by depositing an insulting layer on a sacrificial layer, for example made of a polyamide; it may cover integrated measurement circuits in the silicon substrate.

Abstract: A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and protected by a package cap. The sensitive element, the electrical connection, and the contact pad form an assembly delimited in the first layer by at least one trench, the assembly being covered by the package cap. The package cap includes at least one opening above the contact pad and is integral with the contact pad on the edges of the opening and with a zone located beyond the trench in relation to the assembly. Such a microstructure can find application in particular in microelectromechanical structures.

Abstract: An electronic chip is self-protected by formation of at least part of an electronic circuit of the chip on a thin rigid membrane arranged between first and second cavities that are normally at a substantially identical pressure, much higher than atmospheric pressure. An attempted intrusion, causing a pressure reduction in one of the cavities, creates a pressure difference that breaks the membrane and makes the chip inoperable.

Abstract: The fuel cell (2) is of the kind comprising an anode (12) and a cathode (10) between which an electrolyte (18) is interposed. Solid bodies (20) storing a hydrogen mass, able to be decomposed by combustion, are associated to pyrotechnic means (24,26) to release the hydrogen and bring it into contact with the anode (12). Means (38) tap the ambient air to bring it into contact with the cathode (10). Firing of the pyrotechnic means (24,26) is placed under the control of addressing means (28) embedded in the appliance (2). The surplus water produced by the exchange between the hydrogen and the oxygen is resorbed by the temperature increase induced by combustion of the bodies (20). The solid bodies (20) are supported by an interchangeable card (22).

Abstract: The module is designed for supplying hydrogen to a fuel mini-cell, wherein hydrogen is gradually released by combustion of elements made of pyrotechnic material, after ignition. A device for sequential control of ignition of the pyrotechnic elements comprises a circuit controlling an electrical or light energy source which supplies an ignition control signal causing energy to be applied to the input of a series of connecting means, respectively associated with each of the pyrotechnic elements. A single pyrotechnic element is connected to the energy source at any one time, the elements preceding it having already been used. The connecting means can be sensitive to temperature or to pressure.

Abstract: The component comprises micro electromechanical systems integrated in a cavity of a substrate and a cover sealed onto the substrate and designed to make the cavity hermetic. The cover comprises at least one groove passing through the cover and defining a central zone completely covering the cavity and a peripheral zone in the cover. A sealing material is deposited at least at the bottom of the groove. Fabrication of the component can comprise a first stage of making at least one groove in the cover, a second stage of bringing the substrate and cover into contact, and a third stage of sealing by depositing a sealing material in the bottom of the groove.

Abstract: The microvalve comprises a mini-piston moving due to the thrust of gases given off by firing of a pyrotechnic charge and comprising an aperture designed to enable communication to be established between ends of microchannels of a microfluidic component. When the ends between which communication is to be established open out onto a face of a first planar substrate, the mini-piston is formed in a second planar substrate, adjoined to the first, and comprises a part that is mobile in translation or in rotation in the plane of the second substrate. If a transverse slot is arranged between the ends of the microchannels between which communication is to be established, the mini-piston comprises a rod designed to slide in the slot and the aperture is formed by a transverse orifice formed in the rod of the mini-piston.

Abstract: The microvalve comprises a mini-piston moving due to the thrust of gases given off by firing of a pyrotechnic charge and comprising an aperture designed to enable communication to be established between ends of microchannels of a microfluidic component. When the ends between which communication is to be established open out onto a face of a first planar substrate, the mini-piston is formed in a second planar substrate, adjoined to the first, and comprises a part that is mobile in translation or in rotation in the plane of the second substrate. If a transverse slot is arranged between the ends of the microchannels between which communication is to be established, the mini-piston comprises a rod designed to slide in the slot and the aperture is formed by a transverse orifice formed in the rod of the mini-piston.

Abstract: The microvalve comprises a mini-piston moving due to the thrust of gases given off by firing of a pyrotechnic charge and comprising an aperture designed to enable communication to be established between ends of microchannels of a microfluidic component. When the ends between which communication is to be established open out onto a face of a first planar substrate, the mini-piston is formed in a second planar substrate, adjoined to the first, and comprises a part that is mobile in translation or in rotation in the plane of the second substrate. If a transverse slot is arranged between the ends of the microchannels between which communication is to be established, the mini-piston comprises a rod designed to slide in the slot and the aperture is formed by a transverse orifice formed in the rod of the mini-piston.

Abstract: The microsystems are integrated in a first cavity bounded by at least a substrate and by a top wall formed by at least a part of a first cover. The component has a second cavity bounded by at least the whole of the top wall of the first cavity and by a second cover formed by a thin layer. The second cover can be covered by a coating made of plastic material molded from a casting. The fabrication process of the component comprises deposition, on the whole of the top wall of the first cavity, of a layer of polymer material and annealing of the layer of polymer material. The layer of polymer material acts as sacrificial layer for deposition of the thin layer designed to form the second cover.

Abstract: A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and protected by a package cap. The sensitive element, the electrical connection, and the contact pad form an assembly delimited in the first layer by at least one trench, the assembly being covered by the package cap. The package cap includes at least one opening above the contact pad and is integral with the contact pad on the edges of the opening and with a zone located beyond the trench in relation to the assembly. Such a microstructure can find application in particular in microelectromechanical structures.

Abstract: This invention relates to a secure electronic device comprising: at least an electronic circuit (10) containing information to be protected, an energy source (11); at least one sensor (12, 13, 14) capable of measuring a determined physical magnitude and outputting a value representative of this magnitude, means (15, 16, 17) of comparing each value with at least one predefined threshold (ref1, ref2, ref3) outputting result signals, a device (20) for protection of information comprising means for triggering destruction of at least part of the circuit using pyrotechnic means (27), a decision-making logical device (21) capable of activating the protection device after seeing the result signals, firing means (31) capable of priming a local or global pyrotechnic micro-charge (30) using electrical energy permanently stored in the energy source.

Abstract: A device for the detection of movement of a valuable object, for example in a museum in which a device for detecting at least a rotation of the object, and particularly magnetometers or inclinometers, are mechanically fixed to the object. These detecting devices are coupled to a message transmission device that sends a presence message as long as detection has not taken place and an alert type message when detection has taken place. A monitoring station processes these messages or the absence of these messages, to trigger an alert if necessary.

Abstract: The integrated electromechanical microstructure comprises a base substrate and a cavity closed by a protective cover. Means for adjusting the pressure in the cavity after the protective cover has been sealed comprise at least one element made of pyrotechnic material combustion whereof releases gas into the cavity. The pressure in the cavity can thus be adjusted independently from the sealing process. Selective ignition of the elements made of pyrotechnic material can be achieved by heating electrical resistors or by laser beams coming from outside the microstructure and directed selectively towards the elements made of pyrotechnic material through a transparent zone of the protective cover.