Abstract: A method for measuring interfaces of an optical element, forming part of a plurality of similar elements including at least one reference optical element, the method implemented by a device, the method including: relative positioning of each reference optical element and the measurement beam, to allow a measurement of interfaces of each reference optical element; acquisition of a reference image, of each reference element; positioning of the measured optical element to allow acquisition of a measurement image, of the optical element to be measured; determining a difference of position in a field of view of the measured element with respect to each reference optical element, based on the reference and measurement images; adjusting the position of the measured optical element in the field of view to cancel the difference of position; and measuring the interfaces of the measured optical element by the measurement beam.

Abstract: A device and method for measuring a surface of an object, including at least one light source, at least one optical sensor, and an interferometry device having a measurement arm and a reference arm, the former directing light from each light source towards the surface of the object and directing light from the surface towards each optical sensor; the measurement device, in an interferometry configuration, illuminating the reference arm and the measurement arm with each light source and directing the light from the measurement arm and the reference arm towards each optical sensor to form an interference signal; the measurement device, in an imaging configuration illuminating at least the measurement arm and directing the light from the measurement arm towards the optical sensor to form an image of the surface; the measurement device including a digital processor producing, from the interference signal and the image, information on the surface.

Abstract: A method for measuring interfaces of an optical element, forming part of a plurality of similar elements including at least one reference optical element, the method implemented by a device, the method including: relative positioning of each reference optical element and the measurement beam, to allow a measurement of interfaces of each reference optical element; acquisition of a reference image, of each reference element; positioning of the measured optical element to allow acquisition of a measurement image, of the optical element to be measured; determining a difference of position in a field of view of the measured element with respect to each reference optical element, based on the reference and measurement images; adjusting the position of the measured optical element in the field of view to cancel the difference of position; and measuring the interfaces of the measured optical element by the measurement beam.

Abstract: A method is provided for inspecting the surface of an object such as a wafer having tridimensional structures, using a confocal chromatic device with a plurality of optical measurement channels and a chromatic lens allowing optical wavelengths of a broadband light source to be focused at different axial distances defining a chromatic measurement range. The method includes a step of obtaining an intensity information corresponding to the intensity of the light actually focused on an interface of the object within the chromatic measurement range at a plurality of measurement points on the object by measuring a total intensity over the full spectrum of the light collected by at least some of the optical measurement channels in a confocal configuration.

Abstract: An imaging device is provided for localizing structures through the surface of an object such as a wafer, with a view to positioning a measuring sensor relative to the structures, includes: (i) an imaging sensor; (ii) an optical imager able to produce, on the imaging sensor, an image of the object in a field of view; and (iii) an illuminator for generating an illuminating beam and lighting the field of view in reflection, in which the illuminating beam and lighting the field of view in reflection, in which the illuminator is able to generate an illuminating beam the spectral content of which is adapted to the nature of the object, such that the light of the beam is able to essentially penetrate into the object. Also provided is a system and a method for carrying out dimensional measurements on an object such as a wafer.

Abstract: An imaging method and device is provided for inspecting for the presence, in an object like a wafer, of enclosed structures, such as vias, employing: an imaging sensor; an optical imager able to produce, on the imaging sensor, an object image in a field of view; and an illuminator for generating an illuminating beam and lighting the field of view in reflection, including: acquiring a first image of the object by illuminating the object with a first illuminating beam adapted to the object, such that the light of the beam penetrates the object; acquiring a second image of the object by illuminating the object with a second illuminating beam adapted to the object, such that the light of the beam is reflected by the surface of the object; and comparing the first and second images to identify structures that appear in the first image but not in the second image.

Abstract: A device or apparatus is provided for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath the first surface including (i) profilometry apparatus arranged in order to carry out measurements of shape on the first surface of the wafer according to at least one measurement field; (ii) imaging apparatus facing the profilometry apparatus and arranged in order to acquire a reference image of the structures on or through a second surface of the wafer opposite to the first surface according to at least one imaging field; the profilometry apparatus and said imaging apparatus being arranged so that the measurement and imaging fields are referenced in position within a common frame of reference. A method is also provided to be implemented in this device or this apparatus.

Abstract: A device for positioning a mask relative to the surface of a wafer with a view to the exposure of the wafer, which includes (i) first positioning structure suitable for holding and moving the mask and the wafer in relation to each other; (ii) imaging structure suitable for producing at least one image of the mask and of the surface of the wafer according to at least one field of view, so as to image positioning marks of the mask and of the wafer simultaneously in the field of view; and (iii) at least one optical distance sensor suitable for producing a distance measurement between the surface of the wafer and the mask in the field(s) of view, with a measurement beam which passes at least partially through the imaging structure.

Abstract: A device or apparatus is provided for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath the first surface including (i) profilometry apparatus arranged in order to carry out measurements of shape on the first surface of the wafer according to at least one measurement field; (ii) imaging apparatus facing the profilometry apparatus and arranged in order to acquire a reference image of the structures on or through a second surface of the wafer opposite to the first surface according to at least one imaging field; the profilometry apparatus and said imaging apparatus being arranged so that the measurement and imaging fields are referenced in position within a common frame of reference. A method is also provided to be implemented in this device or this apparatus.

Abstract: A method is provided for inspecting the surface of an object such as a wafer having tridimensional structures, using a confocal chromatic device with a plurality of optical measurement channels and a chromatic lens allowing optical wavelengths of a broadband light source to be focused at different axial distances defining a chromatic measurement range. The method includes a step of obtaining an intensity information corresponding to the intensity of the light actually focused on an interface of the object within the chromatic measurement range at a plurality of measurement points on the object by measuring a total intensity over the full spectrum of the light collected by at least some of the optical measurement channels in a confocal configuration.

Abstract: A confocal chromatic device for inspecting the surface of an object such as a wafer, including a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through a chromatic lens at a plurality of measurement points, the plurality of optical measurement channels including optical measurement channels with an intensity detector for measuring a total intensity of the collected light. A method is also provided for inspecting the surface of an object such as a wafer including tridimensional structures.

Abstract: A device for positioning a mask relative to the surface of a wafer with a view to the exposure of the wafer, which includes (i) first positioning structure suitable for holding and moving the mask and the wafer in relation to each other; (ii) imaging structure suitable for producing at least one image of the mask and of the surface of the wafer according to at least one field of view, so as to image positioning marks of the mask and of the wafer simultaneously in the field of view; and (iii) at least one optical distance sensor suitable for producing a distance measurement between the surface of the water and the mask in the field(s) of view, with a measurement beam, which passes at least partially through the imaging structure.

Abstract: A confocal chromatic device is provided for inspecting the surface of an object such as a wafer, including a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through a chromatic lens at a plurality of measurement points, and a magnifying lens arranged for introducing a variable or changeable scaling factor between the spatial repartition of the collection apertures and the measurement points. A method is also provided for inspecting the surface of an object such as a wafer including tridimensional structures.

Abstract: A microscope device for inspecting structured objects, including: a camera; an optical imager capable of producing, on the camera, an image of the object according to a field of view, and including a distal lens arranged on the side of the object; and a low-coherence infrared interferometer including a measurement beam capable of producing measurements by means of interferences between retroreflections of the measurement beam and at least one separate optical reference. The device also includes coupler for injecting the measurement beam into the optical imaging means in such a way that the beam passes through the distal lens, and the low-coherence infrared interferometer is balanced in such a way that only the measurement beam retroreflections, taking place at optical distances close to the optical distance covered by the beam to the object, produce measurements.

Abstract: An imaging device is provided for localizing structures through the surface of an object such as a wafer, with a view to positioning a measuring sensor relative to the structures, includes: (i) an imaging sensor; (ii) an optical imager able to produce, on the imaging sensor, an image of the object in a field of view; and (iii) an illuminator for generating an illuminating beam and lighting the field of view in reflection, in which the illuminating beam and lighting the field of view in reflection, in which the illuminator is able to generate an illuminating beam the spectral content of which is adapted to the nature of the object, such that the light of the beam is able to essentially penetrate into the object. Also provided is a system and a method for carrying out dimensional measurements on an object such as a wafer.

Abstract: An imaging method and device is provided for inspecting for the presence, in an object like a wafer, of enclosed structures, such as vias, employing: an imaging sensor; an optical imager able to produce, on the imaging sensor, an object image in a field of view; and an illuminator for generating an illuminating beam and lighting the field of view in reflection, including: acquiring a first image of the object by illuminating the object with a first illuminating beam adapted to the object, such that the light of the beam penetrates the object; acquiring a second image of the object by illuminating the object with a second illuminating beam adapted to the object, such that the light of the beam is reflected by the surface of the object; and comparing the first and second images to identify structures that appear in the first image but not in the second image.

Abstract: A microscope device for inspecting structured objects, including: a camera; an optical imager capable of producing, on the camera, an image of the object according to a field of view, and including a distal lens arranged on the side of the object; and a low-coherence infrared interferometer including a measurement beam capable of producing measurements by means of interferences between retroreflections of the measurement beam and at least one separate optical reference. The device also includes coupler for injecting the measurement beam into the optical imaging means in such a way that the beam passes through the distal lens, and the low-coherence infrared interferometer is balanced in such a way that only the measurement beam retroreflections, taking place at optical distances close to the optical distance covered by the beam to the object, produce measurements.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.