Abstract: The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges (37) for Z positioning of the optical component (35) as close as possible to the detector (21) and passive X and Y alignment means via holding wedges and/or holding balls (36), the X, Y and Z axes being axes perpendicular to each other.

Abstract: The layout for an electronic component to be cooled during operation, said layout comprises a support (1) on which the electronic component (16) will be mounted, a base (2) configured so that it will be cooled, and a connecting element (3) mechanically and thermally connecting the base (2) to the support (1) so as to cool it. The connecting element (3) is configured such that the support (1) is free to move relative to the base (2), and the layout comprises a displacement adjustment system (4) configured so as to apply a movement to said support (1) relative to the base.

Abstract: This method for producing a non-plane comprises fitting a flexible component onto a carrier by means of hybridization columns, each column having a first height and including a volume of solder material formed between two surfaces wettable by said solder material added to the flexible component and to the carrier respectively, said wettable surfaces being surrounded by zones non-wettable by the solder material, the wettable surfaces and the volume of solder material being determined as a function of a second height required for the flexible component relative to the carrier at the place where the column is formed, such that the column varies from the first height to the second height when the volume of material is brought to a temperature higher than or equal to its melting point and heating the volumes of solder material of the columns to a temperature higher than or equal to the melting point of said material in order to melt it.

Abstract: This method for producing a non-plane comprises fitting a flexible component onto a carrier by means of hybridization columns, each column having a first height and including a volume of solder material formed between two surfaces wettable by said solder material added to the flexible component and to the carrier respectively, said wettable surfaces being surrounded by zones non-wettable by the solder material, the wettable surfaces and the volume of solder material being determined as a function of a second height required for the flexible component relative to the carrier at the place where the column is formed, such that the column varies from the first height to the second height when the volume of material is brought to a temperature higher than or equal to its melting point and heating the volumes of solder material of the columns to a temperature higher than or equal to the melting point of said material in order to melt it.

Abstract: The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges (37) for Z positioning of the optical component (35) as close as possible to the detector (21) and passive X and Y alignment means via holding wedges and/or holding balls (36), the X, Y and Z axes being axes perpendicular to each other.