Abstract: A mechanical coolant pump for an internal combustion engine includes an outlet channel comprising an outlet valve and an outlet channel wall with a passing slit. An impeller is configured to pump a coolant into the outlet channel. The outlet valve comprises a shiftable flat valve plate configured to be shiftable in a transversal plane of the outlet channel through the passing slit of the outlet channel wall.

Abstract: The invention relates to the fabrication of integrated circuits in general, and notably the circuits of image sensors intended to form the electronic core of photographic apparatus or cameras. The chip is first aligned with respect to the package and then the package is aligned with respect to the optical system. The alignment of the chip with respect to the package is done optically. The alignment of the package with respect to the system is done mechanically with respect to the edges of the package. According to the invention, provision is made for optical marks to be provided on the package, these marks each having an edge aligned with a lateral edge of the package, so as to minimize the positioning errors which would be due to inaccurate positioning of the chip with respect to the edges of the package.

Abstract: A valve has a movable valve element extending across a passageway within a housing and a central aperture, either through the valve element itself or in an adjacent part of the housing, which is opened by movement of the valve element to allow fluid flow between an inlet and an outlet.

Abstract: The invention relates to the fabrication of integrated circuits in general, and notably the circuits of image sensors intended to form the electronic core of photographic apparatus or cameras. The chip is first aligned with respect to the package and then the package is aligned with respect to the optical system. The alignment of the chip with respect to the package is done optically. The alignment of the package with respect to the system is done mechanically with respect to the edges of the package. According to the invention, provision is made for optical marks to be provided on the package, these marks each having an edge aligned with a lateral edge of the package, so as to minimize the positioning errors which would be due to inaccurate positioning of the chip with respect to the edges of the package.

Abstract: The invention relates to very small-sized color image sensors. The sensor according to the invention is made by the following method: the formation, on the front face of the semiconductive wafer (10), of a series of active zones (ZA) comprising image detection circuits and each corresponding to a respective image sensor, each active zone comprising photosensitive zones (12) covered with conductive and insulating layers (14, 16) enabling the collection of electrical charges generated in the photosensitive zones, the transfer of the wafer (10) by its front face against the front face of a supporting substrate (20), the elimination of the major part of the thickness of the semiconductive wafer, leaving a very fine semiconductive layer (30) on the substrate, this fine semiconductive layer comprising the photosensitive zones, the deposition and etching of color filters (18) on the semiconductive layer thus thinned.

Abstract: The invention relates to very small-sized color image sensors.

Abstract: The invention relates to electronic cameras for visualization of light images. The camera (40) includes an electronic image sensor (42) having an active face (79) including an arrangement of photosensitive pixels forming a photosensitive surface (44), electrical conductors on the active face and a free face (102) on the opposite side from the active face, and an optics unit (46) including at least one lens (52) for focusing the light images on the photosensitive surface of the sensor. The optics unit of the camera is mechanically secured to the sensor and, in order to provide centered focusing of the light images on the photosensitive surface of the sensor, at least two positioning surfaces of the optics unit (72, 74) and of the sensor (79) are in direct mechanical contact.

Abstract: The invention relates to photosensitive sensors, especially electronic image sensors made using CMOS integrated circuit technology.

Abstract: In a pneumatic pressure-reducer, the control rod for the control valve is supported and guided by two spring washers whose radial stiffness is at least around 200 times greater than the axial stiffness. Each washer comprises internal and external annular regions connected by at least three inclined arms, separated by openings. Preferably, a restriction is formed between a region of the pressure-reducer situated downstream from the valve and a comparison chamber, the pressure of which acts on a comparison capsule connected to the rod.