Abstract: A vehicular active air flap assembly capable of being opened or closed during a failure may include an air flap that can be manually opened to allow air required during the operation of the vehicle to be supplied into the engine compartment even when the air flap malfunctions, wherein the vehicular active air flap assembly is configured to operate the air flap mounted on a hole formed in a radiator grill to allow cooling air to be supplied into an engine compartment of a vehicle or block the supply of cooling air and wherein the air flap is rotatably coupled at opposite end portions thereof to the radiator grill, and at least one end portion thereof is mounted to be movable in a front-rear direction of the vehicle.

Abstract: A vehicular active air flap assembly capable of being opened or closed during a failure may include an air flap that can be manually opened to allow air required during the operation of the vehicle to be supplied into the engine compartment even when the air flap malfunctions, wherein the vehicular active air flap assembly is configured to operate the air flap mounted on a hole formed in a radiator grill to allow cooling air to be supplied into an engine compartment of a vehicle or block the supply of cooling air and wherein the air flap is rotatably coupled at opposite end portions thereof to the radiator grill, and at least one end portion thereof is mounted to be movable in a front-rear direction of the vehicle.

Abstract: An active air flap is provided. The active air flap includes a plurality of flaps and an elastic member bonding the plurality of flaps to form a preset angle with respect to each other. The elastic member is insert-molded between the respective flaps and a roller is coupled to the top of the active air flap with a connection member and the active air flap is wound there around by a restoring force of the elastic member. Additionally, a support bracket that rotatably supports the roller through pins protrudes from a plurality of ends of the roller, and has an aperture formed therein and the active air flap is configured to open or close the aperture.

Abstract: An active air flap is provided. The active air flap includes a plurality of flaps and an elastic member bonding the plurality of flaps to form a preset angle with respect to each other. The elastic member is insert-molded between the respective flaps and a roller is coupled to the top of the active air flap with a connection member and the active air flap is wound there around by a restoring force of the elastic member. Additionally, a support bracket that rotatably supports the roller through pins protrudes from a plurality of ends of the roller, and has an aperture formed therein and the active air flap is configured to open or close the aperture.

Abstract: An active air flap apparatus for a vehicle is configured to include an air flap 20, a thermoelectric device 40, a PCB 50, a heat transfer bar 60, and a variable length member 70. By the configuration, the air flap may be fixed by forcibly rotating the air flap so as to open the duct at the time of failure while reducing weight and cost, thereby preventing the vehicle from being damaged.

Abstract: A semiconductor substrate includes a photodiode on a support substrate. An insulating layer is provided between the support substrate and the semiconductor substrate. A first conductive pattern is provided in the insulating layer. A first through electrode penetrates the support substrate to be in contact with the first conductive pattern.

Abstract: An active air flap for a vehicle can absorb shock energy by a wing of a housing which pivots in a collision with a pedestrian and can minimize the pedestrian injury as possible.

Abstract: An active air flap for a vehicle can absorb shock energy by means of a wing of a housing which pivots in a collision with a pedestrian and can minimize the pedestrian injury as possible.

Abstract: An active air flap apparatus for a vehicle is configured to include an air flap 20, a thermoelectric device 40, a PCB 50, a heat transfer bar 60, and a variable length member 70. By the configuration, the air flap may be fixed by forcibly rotating the air flap so as to open the duct at the time of failure while reducing weight and cost, thereby preventing the vehicle from being damaged.

Abstract: An image sensor and a method of forming the same, where the image sensor may include a substrate including a pixel region and a pad region, a through via configured to penetrate the substrate in the pad region, a plurality of unit pixels in the pixel region, and a light shielding pattern between the plurality of unit pixels. The through via and the light shielding pattern include a same material.

Abstract: A semiconductor substrate includes a photodiode on a support substrate. An insulating layer is provided between the support substrate and the semiconductor substrate. A first conductive pattern is provided in the insulating layer. A first through electrode penetrates the support substrate to be in contact with the first conductive pattern.

Abstract: A method of manufacturing an image sensor includes forming a device isolation region in an active pixel sensor area of a semiconductor substrate and alignment keys in a scribe lane area of the semiconductor substrate, such that the depth of the alignment keys is equal to or shallower than the depth of the device isolation region. The method further includes forming a photoelectric converter in the active pixel sensor area, polishing a rear surface of the semiconductor substrate and using the alignment keys to form a microlens at a position corresponding to the photoelectric converter on the polished rear surface of the semiconductor substrate.

Abstract: A method of fabricating an image sensor which reduces fabricating costs through simultaneous formation of capacitor structures and contact structures may be provided. The method may include forming a lower electrode on a substrate, forming an interlayer insulating film on the substrate, the interlayer insulating film may have a capacitor hole to expose a first portion of the lower electrode.

Abstract: An image sensor and a method of manufacturing the same are disclosed. An image sensor is formed by forming a photoelectric transformation element at a front surface of a semiconductor substrate in an active pixel sensor region and in an optical black region of the semiconductor substrate, subjecting a surface of the semiconductor substrate opposite the front surface to a removal process to create a back surface of the semiconductor substrate, and forming a light blocking film pattern on the back surface in the optical black region. The light blocking film pattern includes an organic material.

Abstract: A method of manufacturing an image sensor includes forming a device isolation region in an active pixel sensor area of a semiconductor substrate and alignment keys in a scribe lane area of the semiconductor substrate, such that the depth of the alignment keys is equal to or shallower than the depth of the device isolation region. The method further includes forming a photoelectric converter in the active pixel sensor area, polishing a rear surface of the semiconductor substrate and using the alignment keys to form a microlens at a position corresponding to the photoelectric converter on the polished rear surface of the semiconductor substrate.

Abstract: A method of fabricating an image sensor which reduces fabricating costs through simultaneous formation of capacitor structures and contact structures may be provided. The method may include forming a lower electrode on a substrate, forming an interlayer insulating film on the substrate, the interlayer insulating film may have a capacitor hole to expose a first portion of the lower electrode.