Patents by Inventor GIN-HWEE TAN

GIN-HWEE TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230363112
    Abstract: A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials.
    Type: Application
    Filed: June 21, 2023
    Publication date: November 9, 2023
    Inventors: Himanshu Pokharna, Gin Hwee Tan
  • Patent number: 11744044
    Abstract: A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: August 29, 2023
    Assignee: Deeia, Inc.
    Inventors: Himanshu Pokharna, Gin Hwee Tan
  • Publication number: 20220142001
    Abstract: A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways.
    Type: Application
    Filed: November 5, 2021
    Publication date: May 5, 2022
    Inventors: Himanshu Pokharna, Gin Hwee Tan
  • Publication number: 20130048250
    Abstract: The heat pipe made of composite material is a sealed hollow tube being a multilayer structure made of a composite material including copper and aluminum, is filled with water and has an inner surface, an evaporator end, a condenser end and a wick. The wick is attached to the inner surface of the tube. The invention provides a cost effective and lightweight heat pipe as it uses aluminum, which is cheap and light in weight. Also, the invention provides a high performance heat pipe system as it uses copper, which is highly thermally conductive. Therefore, the heat pipe is desirable for thermal management applications in a variety of products.
    Type: Application
    Filed: August 26, 2011
    Publication date: February 28, 2013
    Inventors: HIMANSHU POKHARNA, GIN-HWEE TAN