Patents by Inventor Gin-Nan Yeh

Gin-Nan Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of attaching a heat sink to an IC package
    Patent number: 6918178
    Abstract: An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: July 19, 2005
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Shin-Hua Chao, Shyh-Ing Wu, Kuan-Neng Liao, Gin-Nan Yeh
  • Method of attaching a heat sink to an IC package
    Publication number: 20030106212
    Abstract: An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.
    Type: Application
    Filed: January 17, 2003
    Publication date: June 12, 2003
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shin-Hua Chao, Shyh-Ing Wu, Kuan-Neng Liao, Gin-Nan Yeh