Abstract: Embodiments of multi-cassette carrying cases are provided herein. In some embodiments a multi-cassette carrying case includes: a body having an inner volume; a door coupled to the body to selectively seal off the inner volume; and a plurality of cassette holders disposed in the inner volume to hold one or more substrate cassettes. In some embodiments, a method of transferring substrates includes: placing a substrate in a substrate cassette, wherein an inner volume of the substrate cassette is sealed from an environment outside of the substrate cassette; and placing the substrate cassette in a multi-cassette carrying case.

Abstract: Embodiments of a multi-cassette carrying case are provided herein. In some embodiments a method for transporting a substrate from a first processing device to a second processing device includes docking a substrate cassette to a first chamber; pumping down pressure in the substrate cassette; transferring a substrate through the first chamber to the substrate cassette; sealing the substrate cassette and moving the substrate cassette having the substrate disposed therein from the first chamber to a second chamber; docking the substrate cassette to the second chamber; and transferring the substrate from the substrate cassette through the second chamber.

Abstract: Embodiments of multi-cassette carrying cases are provided herein. In some embodiments a multi-cassette carrying case includes: a body having an inner volume; a door coupled to the body to selectively seal off the inner volume; and a plurality of cassette holders disposed in the inner volume to hold one or more substrate cassettes. In some embodiments, a method of transferring substrates includes: placing a substrate in a substrate cassette, wherein an inner volume of the substrate cassette is sealed from an environment outside of the substrate cassette; and placing the substrate cassette in a multi-cassette carrying case.

Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

Abstract: An automated inspection system and method replaces human visual inspection of the surface of a specimen having distinguishing features or anomalies that are detectable under either one or a combination of bright field and dark field illumination. A preferred embodiment is an after develop inspection macro (ADI Macro) defect inspection system that inspects the patterned surface of a semiconductor wafer for large scale (i.e., greater than about 25 micron minimum dimension range) defects. The ADI Macro inspection system detects defects that appear after the photolithography development step and include regions of defocus ("hot spots"), scratches, pattern blemishes, large particles, (i.e., particles greater than about 25 micron minimum dimension range), extra deposited photoresist, nonuniform photoresist deposition, and edge bead removal inconsistencies.

Abstract: An imaging method creates a two-dimensional image of a voltage distribution or a capacitance distribution of a substrate under test using an electro-optic modulator. A coarse modulator calibration determines the effect of non-uniformities in the modulator and determines a look-up table relating the gap distance between the modulator and the substrate to the intensity of the light emerging from the modulator. A positioning means calibration determines a look-up table relating control voltage to response by the positioning means. The modulator is moved over a portion of the substrate and then undergoes a positioning step, a fine onsite calibrating step, and a measuring step. The positioning step can be accomplished using the intensity of emerging light to determine modulator gap distance, and the response verses control voltage look-up table to determine a control signal to vertically position the modulator.

Abstract: A laser-based repair system provides for material removal and deposition using a repair tool having a first laser operating at a high power for cutting signal lines and operating at a lower power for ablating a target repair area in conjunction with a liquid dispensing apparatus for application of the liquid solution in a target area, and a second laser for decomposing the liquid solution in an applied layer prior to the ablation of material in the target repair area. Various repair processes can be undertaken. The invention allows high-speed material deposition and removal on a surface. In a specific embodiment of the invention, the liquid solution used is a palladium acetate and a solvent or other metallo-organic solution which is capable of pyrolytic reaction and decomposition to an electrically conductive residue. A liquid applicator or dispensing apparatus is provided which is suited to applying fine traces of liquid without clogging.