Abstract: A semiconductor device includes an elongated cooler through which a refrigerant flows; a plurality of semiconductor modules, each including one or more semiconductor elements; and a passive element configured to drive the plurality of semiconductor modules, the cooler includes a first cooling surface; and a second cooling surface opposing the first cooling surface, the plurality of semiconductor modules is arrayed in a longitudinal direction of the cooler and is coupled to, or is in contact with, the first cooling surface, and the passive element is coupled to, or is in contact with, the second cooling surface.

Abstract: A semiconductor apparatus includes: a semiconductor module; a cooler including flow paths through which a refrigerant flows; a casing including a bottom surface; at least one first fixing member fixing the cooler to the bottom surface; and at least one second fixing member fixing the cooler to the bottom surface. The cooler includes: an outer surface directed to the bottom surface of the casing; an inner surface that is a part of wall surfaces of the flow paths on an opposite side to the outer surface; an outer wall to which the at least one first fixing member is connected; and an outer wall that is on an opposite side to the outer wall and to which the at least one second fixing member is connected. The semiconductor module is positioned between the bottom surface of the casing and the outer surface of the cooler, and is pressed by these two surfaces.

Abstract: A cooler includes: a cooling wall including a first surface and a second surface; a first path extending in a first direction and having an inlet for a refrigerant; a second path extending in the first direction and having an outlet for the refrigerant; a cooling path causing the first path to communicate with the second path in a second direction intersecting the first direction; a partition spaced from the cooling wall in a third direction perpendicular to the first surface, separating the first and second paths from the cooling paths, and including a third surface constituting a part of a wall surface of the first path, the third surface including a first portion and a second portion differing from the first portion in position in the third direction. The first path includes a first gas retaining space defined by the first and second portions.

Abstract: A cooling apparatus includes: a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface, and radiating fins protruding from the second surface; and a second member including a third surface facing the second surface, a refrigerant flows between the first member and the second member, the second member includes a first protrusion protruding from the third surface toward a space, the space existing between the radiating fins in a flow direction of the refrigerant, the first protrusion includes a first slope inclined to the third surface, the first slope includes a first end and a second end, the first end is closer to the second surface than the second end, the second end is closer to the third surface than the first end, the first end is positioned downstream in the flow direction from the second end.