Patents by Inventor Gino J. F. Shian

Gino J. F. Shian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of testing a ball grid array IC
    Patent number: 6121063
    Abstract: A method of testing a ball grid array (BGA) integrated circuit (IC) package such that no solder balls are attached to the BGA IC package when burn-in testing using a burn-in testing socket is carried out. In this method, landings on the substrate of the BGA IC package directly contact the test contacts of the burn-in testing socket. Furthermore, the substrate of the BGA IC package is cleaned with hydrogen peroxide solution before solder balls are attached onto the landings of the BGA IC substrate.
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: September 19, 2000
    Assignee: United Microelectronics Corp.
    Inventors: Hermen Liu, Gino J. F. Shian