Abstract: A printed-circuit board designed to energize a multiplicity of integrated chips or other modular units comprises on a first face two closely spaced main conductor strips, respectively connected to an ungrounded and a grounded terminal of a d-c source, extending along an edge thereof, together with a number of ancillary ground conductors paralleling these strips at substantially equispaced locations. The second face carries a multiplicity of branch lines perpendicular to the strips, each line consisting of two closely spaced leads respectively joined to the ungrounded strip and to the main and ancillary ground conductors through connectors traversing the board. The leads of each branch line are bridged by several storage capacitors and are so spaced apart and dimensioned as to provide a line inductance low enough to make the resonance frequency of the line substantially higher than the operating frequency of the associated loads.