Abstract: A microphone assembly and a method for reducing a temperature dependency of a microphone assembly are disclosed. In an embodiment, the microphone assembly includes a transducer and a voltage supply for the transducer, wherein the voltage supply is configured to supply a temperature dependent voltage for reducing a temperature dependency of the microphone assembly.

Abstract: An electronic circuit for a microphone comprises a first terminal and a second terminal, wherein the electronic circuit is selectively operable in a first mode and a second mode. In the first mode, the first terminal is configured for microphone output and in the second mode, the second terminal is configured for microphone output. Furthermore, a method of operating a microphone is provided.

Abstract: A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (MO) and a collapse mode (M1). The mode controller switches to the collapse mode (M1) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (MO) when the output signal reaches or falls below a predefined further threshold value (S1).

Abstract: A microphone assembly is disclosed. In an embodiment, the assembly includes a transducer and an electronic circuit operatively connected to the transducer, wherein the electronic circuit comprises a test mode circuitry configured to selectively set the microphone assembly in one or more test modes or an operational mode, and wherein the one or more test modes enable determining at least one parameter of the transducer.

Abstract: A microphone assembly and a method for manufacturing a microphone assembly are disclosed. In an embodiment, the microphone assembly includes a MEMS dual backplate microphone configured to provide a differential output signal, an ASIC including a differential amplifier configured to receive the differential output signal and a control element configured to adjust at least one of a setting of the MEMS dual backplate microphone and a setting of the ASIC.

Abstract: A MEMS microphone assembly includes a MEMS transducer element having a back plate and a diaphragm displaceable relative to the back plate. A bias voltage generator is adapted to provide a DC bias voltage applicable between the diaphragm and the back plate. An amplifier receives an electrical signal from the MEMS transducer element and provides an output signal. The amplifier is adapted to amplify the electrical signal from the MEMS transducer element according to an amplifier gain setting. A processor is adapted to carry out a calibration routine at power-on of the microphone assembly determining information regarding the DC bias voltage and/or the amplifier gain setting.

Abstract: An assembly includes an analog signal processing unit. An analog signal path and an amplifier an automatic gain control unit are coupled to the signal path. Further to the output of the amplified analog signal, a gain information is provided as an analog or digital signal at a gain information output. This information can be used for further processing the signal, e.g., by automatic noise compression or to control further signal processing units.

Abstract: The present invention relates to a condenser microphone assembly comprising an electro-acoustic transducer element comprising a diaphragm and a back plate, signal processing circuitry operatively connected to the transducer element so as to process signals generated by the transducer element, and a mode-setting circuitry for selectively setting the condenser microphone assembly in a test mode or an operational mode. The electro-acoustic sensitivity of the condenser microphone assembly, when operated in the test mode, is at least 40 dB lower than the corresponding electro-acoustic sensitivity of the assembly when operated in the operational mode. The present invention further relates to a method for determining a performance parameter of a signal processing circuitry mounted inside a housing of an assembled condenser microphone assembly.

Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.

Abstract: The present invention relates to a condenser microphone assembly comprising an electro-acoustic transducer element comprising a diaphragm and a back plate, signal processing circuitry operatively connected to the transducer element so as to process signals generated by the transducer element, and a mode-setting circuitry for selectively setting the condenser microphone assembly in a test mode or an operational mode. The electro-acoustic sensitivity of the condenser microphone assembly, when operated in the test mode, is at least 40 dB lower than the corresponding electro-acoustic sensitivity of the assembly when operated in the operational mode. The present invention further relates to a method for determining a performance parameter of a signal processing circuitry mounted inside a housing of an assembled condenser microphone assembly.

Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.